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John H. L. PANG, PhD, Fellow-ASME, Member-IEEE

Contact Detail : E-mail : mhlpang@ntu.edu.sg

Nanyang Technological University School of Mechanical & Aerospace Engineering, 50 Nanyang Avenue, Singapore 639798.

Tel: 65-6790-5514 Fax: 65-6795-4630

Academic Qualifications :

Ø PhD (Mech. Eng.), University of Strathclyde, Scotland, UK, 1989

Ø BSc (Mech. Eng.), University of Strathclyde, Scotland, UK, 1985

Professional Memberships :

Ø Fellow, American Society of Mechanical Engineers (FASME)

Ø Member, Institute of Electrical & Electronic Engineering (MIEEE)

Summary of Work Experience:

Ø 1999 – 2008 Associate Professor, NTU

Ø 1994 – 1998 Senior Lecturer, NTU

Ø 1990 – 1993 Lecturer, NTU

Ø 1989 – 1990 Research Engineer, The Welding Institute, Cambridge, UK

Journal Editorial Roles :

Ø Editorial Advisory Board, International Journal of Fatigue, since 1997

Ø Associate Editor of ASME Journal of Electronic Packaging, since 2004

Ø Associate Editor, IEEE Trans. Advanced Packaging, since 2004

Ø Associate Editor, IEEE Trans. Components and Packaging Technologies, since 2005

Research Expertise and Interest :

Ø Micro/Nano-mechanical deformation analysis by DIC on AFM/SEM/Optical Image

Ø Intermetallic compound diffusion kinetics : thermal coupled mechanical/electrical load

Ø Strain-rate effects from 0.01-10 (1/s) & 500-1500 (1/s) for micro-materials

Ø Constitutive modeling of Pb-free solders: Elastic-Plastic-Creep, Strain Rate/Viscoplastic

Ø Fracture mechanics and Interface fracture (adhesive, intermetallic, fusion bonding)

Ø Creep/Fatigue/Impact modeling with finite element analysis (implicit & explicit FEA)

Ø Design for reliability of electronic assemblies (Thermo-Mechanical/Vibration/Drop)

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