A. CONTRIBUTIONS
TO TEACHING (A1) Book chapters Ø John H. L. Pang
(2007) Chapter 12 : “Lead-Free Solder
Materials : Design For Reliability” In textbook: “Micro- and Opto-Electronic
Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging”,
Volume 1 Materials Physics / Materials Mechanics. By Suhir, Ephraim; Lee, Y.C.;
Wong, C.P. (Eds.), Springer, ISBN 978-387-27974-9, pp 429-458. Ø Suresh K. Sitaraman and John H.L.
Pang (2001) Chapter 5:
“Fundamentals of Package Design-For-Reliability” in Textbook: “Introduction to
Microelectronics Systems Packaging Technologies” McGraw-Hill, 2001, p184-210. (A2) Development of teaching programs and materials Lectured in the following courses : - Ø M6135 Failure Analysis and Prevention, (MSc-MPM) Ø M6325 Advanced Electronic Packaging, (MSc-PE) Ø
M6704 IC and
Microsystems Packaging (MSc-MEMS) Ø
MP4F10 Electronic
Manufacturing and Packaging (BEng) Ø
M424 Marine & Offshore Structural Integrity (BEng) Tutored in the following
subjects :- Ø MP2001 Mechanics of Materials Ø MP2011 Machine Element Design Ø M140 Engineer in Society (A3) Short courses conducted Ø 10 December 2007 – Forum Leader/Speaker “Drop Impact Reliability : Challenges &
Research” Ø 7 December 2005 – Short Course on “Lead-Free Solder Materials and Reliability
Performance” Ø 24-26 November 2004 - Short Course on “Materials
Failure Analysis” Ø 7 September 2004 - Short Course on “Lead Free Solder
Joint Reliability Test and Analysis” Ø 10 December 2002 - Short Course on “Lead Free Solder
Materials and Reliability Performance” __________________________________________________________________ |