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C. CONTRIBUTIONS TO SERVICE

 

 

(C1) Leadership and Service at Nanyang Technological University

 

2006 – 2008 :   Head, Engineering Mechanics Division, School of MAE

2005 – 2006 :   Staff Officer – Research, School of MAE, Vice-Dean Research Office,

2002 – 2006 :   Director, Electronic Packaging Strategic Research Program, School of MAE

 

 

(C2) Leadership and Service to Professional Bodies

 

Chairman, ASME Singapore Section, 2006-2007

Chairman, IEEE-CPMT Int. Conf. on Electronics Packaging Technology, EPTC 2006

Editor, The Mechanical Engineer, ASME_SG Yearbook, 2006-2007

Executive Committee, ASME Singapore Section, 2003 – 2007

Executive Committee, IEEE Reliability/CPMT/ED Singapore Chapter, 2006

Member, National Committee of Engineering Organization (NCEO), IES, 2003 - 2007

 

 

(C3) Leadership and Service at International Conferences

 

Mechanics Track Chair, IEEE/ASME ITHERM 2010, 2008, 2006, 2004 Conference, USA

Track Chair, Reliability ASME InterPACK Conference, 2009, USA.

Member, Quality and Reliability Technical Committee, ECTC 2009, 2008, 2007, 2002-06, USA

General Chair, 8th Electronics Packaging Technology Conference, 6-8 December 2006.

 

 

(C4) Invited Presentations at Scientific Meetings/Workshops

 

2007 : John H.L. Pang “Strain Rate Characterization of Solder Materials and Solder Joint Failure Analysis” – EPTC 2007 Technical Forum(A4), May 10-12th, 2007

2007:  John H.L. Pang  “Overview of Pb-Free Solder Materials & Reliability Issues” – 2007 Interconnection Material Technology Symposium, Semicon Singapore, May 7th, 2007

2005 :  John H.L. Pang  “Drop Impact Characterization and Modeling of Pb-free solders – What is needed  IPC/JEDEC 9th International Conference on Lead Free Electronic Components and Assemblies, August 18th, 2005, Singapore.

2002:  John H.L. Pang, B.S. Xiong and H. Kurniawijaya “Bulk Specimen and Solder Joint Mechanical Properties of SnAgCu Solder Alloy” TMS Fall Meeting 2002, Pb-Free and Pb-Bearing Solders, 6-10 October 2002, Columbus OHIO. (Invited Paper)

2000 :  John H.L. Pang and Y.R. Chong. “FEA modeling of FCOB assembly solder joint reliability”, Proceeding of International Conference on Micro Materials, MicroMat, Berlin, April 17-19, 2000, (Semi-Plenary session V1)