B. CONTRIBUTIONS
TO RESEARCH (B1) Research Projects and Funding 2008–2010, MOE funded project, RG14/07, “Fundamental
research on strain rate induced effects in ductile to brittle failure
mechanisms”, Principal Investigator (PI),
AcRF Tier 1, $100,000. 2006–2009, SIMTech-NTU/MAE project agreement on
“Development of micro interconnection structure for direct flip chip attachment
and micro device integration”, Co-Principal Investigator (Co-PI), Internal Funding by SIMTech, S$570,000. 2000–2004,
MOE – ARC and A*Star funded project, JT-ARC 6/00 “Design-For-Reliability
Methodology For Evaluation of Lead-Free Solder Performance In Electronic
Packaging Assemblies”, Principal Investigator (PI) : S$1.208 million. 1996-1999,
NSTB funded Gintic Upstream Research Project, U96-P-169, “Development of
a Mechanical/Thermal Fatigue Reliability Methodology for SMT and
Interconnection design” Principal Investigator (PI) : S$1.26 million. (B2) Patent Filed and NTU Invention/Technical
Disclosures 2007 Patent filed in Singapore : “An Interconnect
Structure and A Method of Fabricating The Same” Wong CK Stephen, Pang HLJ, Fan
W., Lu HJ, Lok BK. Singapore Patent Application No. 200717535-9 Two NTU invention/technology disclosures, TD/324/03/MPE
and TD/333/03/MPE (B3) Supervision of PhD Students On-going Supervision of PhD Students:- Mr Mr Sun Gengzhi (PhD candidate) PhD Students Graduated :- Dr Dr Xu Luhua (PhD
– 2007) Dr Ngoh Shwu Lan (PhD – 2007) Dr Dr |