D. SELECTED
JOURNAL PUBLICATIONS
2008 Sun YF, Pang JHL: Experimental
and numerical investigations of near-crack-tip deformation in a solder alloy,
ACTA MATERIALIA Volume: 56 Issue: 3
Pages: 537-548 Published: FEB 2008, IF=3.624 Xu LH, Pang
JHL, Che FX: Impact
of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
, JOURNAL OF ELECTRONIC MATERIALS
Volume: 37 Issue: 6 Pages: 880-886
Published: JUN 2008. IF = 1.32 Chong DYR, Che FX, Pang JHL, et al.: Evaluation
on influencing factors of board-level drop reliability for chip scale packages
(Fine-Pitch ball grid array),
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume: 31 Issue: 1 Pages: 66-75
Published: FEB 2008. IF=1.011 Yaofeng S, Pang JHL: Digital
image correlation for solder joint fatigue reliability in microelectronics
packages, MICROELECTRONICS RELIABILITY Volume: 48 Issue: 2
Pages: 310-318 Published: FEB 2008. IF = 1.011 Wong CK, Pang JHL, Tew JW, et al The
influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and NiUBM reaction in
reflow soldering and isothermal aging, MICROELECTRONICS
RELIABILITY Volume: 48, Pages 611-621, 2008. IF
= 1.011
2007 Xu LH, Dixit P, Miao J, Pang
JHL et al.: Through-wafer
electroplated copper interconnect with ultrafine grains and high density of
nanotwins, APPLIED PHYSICS LETTERS Volume:
90 Issue: 3
Article Number: 033111 Published: JAN 15 2007, IF = 3.596 Sun YF, Pang JHL, Fan W: Nanoscale
deformation measurement of microscale interconnection assemblies by a digital
image correlation technique Dixit P, Tan CW, Xu LH, Nay
L, Miao JM, Pang JHL et al.: Fabrication
and characterization of fine pitch on-chip copper interconnects for advanced
wafer level packaging by a high aspect ratio through AZ9260 resist
electroplating, JOURNAL OF MICROMECHANICS AND
MICROENGINEERING Volume: 17
Issue: 5 Pages: 1078-1086 Published: MAY
2007. IF = 1.931 Dixit P, Xu L, Miao J, Pang
JHL, et al.: Mechanical and
microstructural characterization of high aspect ratio through-wafer
electroplated copper interconnects JOURNAL OF
MICROMECHANICS AND MICROENGINEERING Volume: 17 Issue: 9
Pages: 1749-1757 Published:
SEP 2007. IF = 1.931 Yaofeng S, Pang JHL: Study
of optimal subset size in digital image correlation of speckle pattern images,
OPTICS AND LASERS IN ENGINEERING
Volume: 45 Issue: 9 Pages: 967-974
Published: SEP 2007. IF = 0.872 Pang
JHL, Che FX: Isothermal cyclic bend fatigue test
method for lead-free solder joints 2006 Xu LH, Pang
JHL, Tu KN: Effect of
electromigration-induced back stress gradient on nanoindentation marker
movement in SnAgCu solder joints, APPLIED
PHYSICS LETTERS Volume: 89
Issue: 22 Article Number: 221909 Published: NOV 27
2006. IF = 3.596 Ren F, Nah JW, Tu KN, Xiong
BS, Xu LH, and Pang JHL.: Electromigration
induced ductile-to-brittle transition in lead-free solder joints, APPLIED PHYSICS LETTERS Volume: 89 Issue: 14
Article Number: 141914 Published: OCT 2 2006. IF = 3.596 Sun YF, Pang JHL: AFM
image reconstruction for deformation measurements by digital image correlation,
NANOTECHNOLOGY Volume: 17 Issue: 4
Pages: 933-939 Published: FEB 28 2006. IF = 3.31 Xu LH, Pang
JHL: Nano-indentation
characterization of Ni-Cu-SnIMC layer subject to isothermal aging, THIN SOLID FILMS Volume: 504 Issue: 1-2
Pages: 362-366 Published: MAY 10 2006. IF = 1.693 Xu LH, Pang
JHL: In-situ
electromigration study on Sn-Ag-Cu solder joint by digital image speckle
analysis, JOURNAL OF ELECTRONIC MATERIALS
Volume: 35 Issue: 11, Pages: 1993-1999
Published: NOV 2006. IF = 1.32 Xu LH, Pang
JHL, Ren F, et al.: Electromigration
effect on intermetallic growth and Young's modulus in SAC solder joint,
JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 12, Pages: 2116-2125
Published: DEC 2006. IF = 1.32 Xu LH, Pang
JHL: Nanoindentation on
SnAgCu lead-free solder joints and analysis Shi XQ, Zhang XR, Pang JHL: Determination
of interface fracture toughness of adhesive joint subjected to mixed-mode
loading using finite element method, INTERNATIONAL
JOURNAL OF ADHESION AND ADHESIVES Volume: 26 Issue: 4
Pages: 249-260 Published: JUL 2006. IF = 1.250. Wang YQ, Low KH, Pang HLJ, et al.: Modeling
and simulation for a drop-impact analysis of multi-layered printed circuit
boards, MICROELECTRONICS RELIABILITY
Volume: 46 Issue: 2-4 Pages: 558-573
Published: FEB-APR 2006. IF = 1.011 Yeo A, Lee C, Pang JHL:
Flip chip solder joint reliability
analysis using viscoplastic and elastic-plastic-creep, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume: 29 Issue: 2 Pages: 355-363
Published: JUN 2006. IF = 0.816. Chong DYR, Che FX, Pang JHL, et al.: Drop
impact reliability testing for lead-free and lead-based soldered IC packages,
MICROELECTRONICS RELIABILITY Volume: 46 Issue: 7
Pages: 1160-1171 Published:
JUL 2006. IF = 1.011 2005 Sun YF, Pang JHL, Wong CK, et al.: Finite element formulation for a
digital image correlation method, APPLIED
OPTICS Volume: 44
Issue: 34 Pages: 7357-7363 Published: DEC
1 2005. IF = 1.701 Pang
JHL, Xiong BS: Mechanical properties for
95.5Sn-3.8Ag-0.7Cu lead-free solder alloy , IEEE
TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume: 28 Issue: 4 Pages: 830-840
Published: DEC 2005. IF = 0.816. Xu LH, Pang
JHL, Prakash KH, et al.: Isothermal
and thermal cycling aging on IMC growth rate in lead-free and lead-based solder
interface, IEEE TRANSACTIONS ON COMPONENTS AND
PACKAGING TECHNOLOGIES Volume: 28
Issue: 3 Pages: 408-414 Published: SEP
2005. IF = 0.816. 2004 Pang
JHL, Low TH, Xiong BS, et al.: Thermal cycling aging effects on
Sn-Ag-Cu solder joint microstructure, IMC and strength, THIN SOLID FILMS Volume: 462 Pages: 370-375
Published: SEP 2004. IF = 1.693 Pang
JHL, Xiong BS, Low TH: Low cycle fatigue models for lead-free
solders , THIN SOLID FILMS
Volume: 462 Pages: 408-412 Published: SEP
2004. IF = 1.693 Pang
JHL, Xu LH, Shi XQ, et al.: Intermetallic growth studies on
Sn-Ag-Cu lead-free solder joints, JOURNAL OF
ELECTRONIC MATERIALS Volume: 33
Issue: 10 Pages: 1219-1226 Published: OCT
2004. IF = 1.32 Pang
JHL, Xiong BS, Low TH: Low cycle fatigue study of lead free
99.3Sn-0.7Cu solder alloy, INTERNATIONAL
JOURNAL OF FATIGUE Volume: 26
Issue: 8 Pages: 865-872 Published: AUG
2004. IF = 1.41 Shi XQ, Pang HLJ, Zhang XR: Investigation
of long-term reliability and failure mechanism of solder interconnections with
multifunctional micro-moire interferometry system, MICROELECTRONICS RELIABILITY Volume: 44 Issue: 5
Pages: 841-852 Published: MAY 2004. IF = 1.011 Shi XQ, Pang HLJ, Zhang XR, et al.: In-situ micro-digital image speckle
correlation technique for characterization of materials' properties and
verification of numerical models IEEE
TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume: 27 Issue: 4 Pages: 659-667
Published: DEC 2004. IF = 0.816. John H.L. Pang, B.S. Xiong and T.H. Low, Comprehensive
Mechanics of Materials Characterization of Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder,
Micromaterials and Nanomaterials, issue 3, 2004, Fraunhofer IZM, Berlin.
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