John H. L. PANG, PhD, Fellow-ASME, Member-IEEE


Contact Detail : E-mail : mhlpang@ntu.edu.sg


Nanyang Technological University

School of Mechanical & Aerospace Engineering,

50 Nanyang Avenue,

Singapore 639798.



Tel: 65-6790-5514

Fax: 65-6795-4630



Academic Qualifications :

  PhD (Mech. Eng.), University of Strathclyde, Scotland, UK, 1989

  BSc (Mech. Eng.), University of Strathclyde, Scotland, UK, 1985


Professional Memberships :

  Fellow, American Society of Mechanical Engineers (FASME)

  Member, Institute of Electrical & Electronic Engineering (MIEEE)


Summary of Work Experience:

  1999 2008 Associate Professor, NTU

  1994 1998 Senior Lecturer, NTU

  1990 1993 Lecturer, NTU

  1989 1990 Research Engineer, The Welding Institute, Cambridge, UK


Journal Editorial Roles :

  Editorial Advisory Board, International Journal of Fatigue, since 1997

  Associate Editor of ASME Journal of Electronic Packaging, since 2004

  Associate Editor, IEEE Trans. Advanced Packaging, since 2004

  Associate Editor, IEEE Trans. Components and Packaging Technologies, since 2005


Research Expertise and Interest :


  Micro/Nano-mechanical deformation analysis by DIC on AFM/SEM/Optical Image

  Intermetallic compound diffusion kinetics : thermal coupled mechanical/electrical load

  Strain-rate effects from 0.01-10 (1/s) & 500-1500 (1/s) for micro-materials

  Constitutive modeling of Pb-free solders: Elastic-Plastic-Creep, Strain Rate/Viscoplastic

  Fracture mechanics and Interface fracture (adhesive, intermetallic, fusion bonding)

  Creep/Fatigue/Impact modeling with finite element analysis (implicit & explicit FEA)

  Design for reliability of electronic assemblies (Thermo-Mechanical/Vibration/Drop)