Poems

香江岁月博文约礼

张平

前言

驰骋异域，眼界渐宽，随之困惑顿添，求索兴趣盎然；孤身漂泊，触景生情，情之精髓在于诚，诚可服人取天下；博文约礼，凤凰旗下，云游儒辈附庸风雅，之乎者也锦绣年华。

一九九五年岁末于中文大学

自勉

坐井观天夜郎眼

云游方知河脉艳

耳濡目染励少年

抖擞今朝莫等闲

作于赴英留学前在京集训的日子

攀登

旭日东升紫荆红

皓月登空斗烟花

夜夜忘归家

岱山沉寂鸟轻啼

碧水潺涓鱼自眠

苦苦求索难

九五年十二月作于中文大学获博士学位后

秋风赋

秋风起君又离

相思红叶随

寒夜里孤月寂

歌声化作雨

风多情雨似泪

两情总相依

长分别盼相聚

儿女情长累

九四年中秋构思于吐露港畔

无题

浩渺烟波彩虹间

轻盈矫健云飞燕

惊涛汹涌信步闲

芙蓉翘首觅白帆

水拍金沙夕阳艳

绚丽涟漪舞翩翩

众星捧月端倪头

浪花朵中笑声甜

九四年十月石澳游记

风

江清月金和风熙

日暮漫舞悦友邻

宾至梦境

数不尽风流倜傥

山绿野旷细雨濛

夜半歌声故园情

客居异乡

谁不痴狂枉自强

九四年十二月于圣诞晚会后

山水情

香江吐露润沙田

碧波含羞戏海澜

绿树浓荫骄阳炎

黄叶满山皓月寒

夜光朦胧倚窗前

细雨佛面不觉眠

芦花遥和鸳鸯弦

草裙沐浴蝴蝶泉

九五年七月雨夜情怀

怀乡

南苑深处雨龙潭

北峰孤立稷山王

鸡鸣晨喧曙光寒

童生早咏文华院

少小鸿图过潼关

西望长安别晋川

走马兰台类转蓬

悦儿还是故乡明

九五年十二月于中文大学

九歌

一曲奥运歌

几滴河残泪

牢骚雄狮醉

儒辈群情激

民声表亦尽

中华天地魂

作于赴英留学前在京集训的日子

赠友人

婀娜多姿红衣裳

唇枪舌战克群雄

见地超越时空观

一代才女胜百男

作于赴英留学前在京集训的日子

          Papers

1. Y. P. Zhang, M. Swaminathan, “RF and microwave subsystem modules for wireless communications,” Editorial, International Journal of RF and Microwave Computer-Aided Engineering, May 2006. 

2. Y. P. Zhang, “Integration of antenna on IC package: An elegant antenna solution to single-chip radio,” Keynote Address at Antenna Systems and Short-Range Wireless Conference, September 22-23, 2005, Santa Clara, CA. USA. 

3. Y. P. Zhang, “Antenna-in-package (AiP) technology for modern radio systems,” Invited Address at IEEE Workshop on Antenna Technology, March 6-8, 2006, New York, USA.

4. Y. P. Zhang, Z. M. Chen, M. Sun, J. He, “Wireless chip area network (WCAN): A new paradigm for RF microelectronics and radio communications,” Invited Address at IEEE Workshop on Electrical Design of Advanced Packaging and Systems to be held from 16-18 December 2006, Shanghai, China.   

5. Y. P. Zhang, “Underground propagation,” Invited Chapter of Wiley’s Encyclopedia of RF and Microwave Engineering, Vol. 6, pp. 5423-5433.

6. M. Z. Tong, Y. P. Zhang, Y. L. Lu, “Design and analysis of integrated-circuit package antennas (ICPA) and filters (ICPF) for highly integrated wireless transceivers,” Invited Chapter of Research Signpost’s Signal Integrity Engineering for Integrated Microwave and High Speed Circuits.

7. Y. P. Zhang “Design and experiment of differentially-driven microstrip antennas,” to appear in IEEE Transactions on Antennas and propagation, 2007.

8. Y. P. Zhang, Qiang Li, “Performance of UWB impulse radio with planar monopoles over on-human-body propagation channel for wireless body area networks,” Revised for IEEE Transactions on Antennas and Propagation.

9. Andrew Poh, Y. P. Zhang, “Design and analysis of transmit/receive switch in triple-well CMOS for MIMO wireless systems,” to appear in IEEE Transactions on Microwave Theory and Techniques, 2007.

10. Q. Li, Y. P. Zhang, “A 1.5-V 2–9.6-GHz Inductor-less Low-Noise Amplifier in 0.13-µm CMOS,” to appear in IEEE Journal of Solid-State Circuits. 

11. Z. M. Chen, Y. P. Zhang, “Inter-Chip Wireless Communication Channel: Measurement, Characterization, and Modeling,” to appear in IEEE Transactions on Antennas and Propagation.

12. Q. Li, Y. P. Zhang, “CMOS T/R switch design: towards ultrawide-band and higher frequency,” to appear in IEEE Journal of Solid-State Circuits.  This is the first regular paper that has ever been accepted up to now by this IEEE Flagship Journal from NTU and the second from Singapore.

13. Y. P. Zhang, M. Sun, “Dual-band microstrip bandpass filter using stepped impedance resonators with new coupling schemes,” IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 10, pp. 3779-3785, October 2006. This was  one of the top 100 accessed papers from the IEEE Xplore in October 2006.

14.  Y. P. Zhang, Q. Li, W. Fan, C. H. Ang, H. Li, “A differential CMOS T/R switch for multi-standard applications,” IEEE Transactions on Circuits and Systems II,  Vol. 53, No. 8, pp. 782-786, August 2006.

15. Y. P. Zhang, L. H. Guo, M. Sun, “High transmission gain inverted-F antenna on low resistivity Si for wireless interconnect,” IEEE Electron Device Letters, Vol. 27, No. 5, pp. 374-376, May 2006.

16. Y. P. Zhang, X. J. Li, A. Phang, “A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers,” IEEE Transactions on Advanced Packaging, Vol. 29, No. 2, pp. 354-358, May 2006.

17. Y. J. Zheng, Y. P. Zhang, Y. Tong, “A novel wireless interconnect technology using impulse radio for inter-chip communications,” IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 4, pp. 1912-1920, April 2006.

18. Y. P. Zhang, J. J. Wang, “Theory and analysis of differentially-driven microstrip antennas,” IEEE Transactions on Antennas and propagation, Vol. 54, No. 4, pp. 1092-1099, April 2006.

19. J. J. Wang, Y. P. Zhang, C. W. Lu, K. M. Chua, “Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers,” IEEE Transactions on Antennas and Propagation, Vol. 53, No. 12, pp. 3877-3883, December 2005.

20. M. Sun, Y. P. Zhang, “Performance of inter-chip RF-interconnect using CPW, capacitive coupler and UWB transceivers,” IEEE Transactions on Microwave Theory and Techniques, Vol. 53, No. 9, pp. 2650-2655, September 2005. This was one of the top 50 downloaded papers from the MTT 2005 (Source: MTT Editor-in-Chief, Editorial, June Issue 2006). This was also one of the top 100 accessed papers from the IEEE Xplore in September 2005.

21.  Y. Chen, Y. P. Zhang, “A planar antenna in LTCC for single-package UWB radio,” IEEE Transactions on Antennas and Propagation, Vol. 53, No. 9, pp. 3089-3093, September 2005.

22. Y. P. Zhang, M. Sun, L.H. Guo, “On-chip antennas for 60 GHz radios in silicon technology,” IEEE Transactions on Electron Devices, Vol. 52, No. 7, pp. 1664-1668, July 2005.

23. Y. P. Zhang, “Integrated circuit ceramic ball grid array package antenna,” IEEE Transactions on Antennas and Propagation, Vol. 52, No. 10, pp. 2538-2544, October 2004.

24.  Y. Chen, Y. P. Zhang, “Integration of ultra-wideband slot antenna on LTCC substrate,”  Electronics Letters, Vol. 40, No. 11, pp. 645-646, May 2004.

25. Y. P. Zhang, “Finite-difference time-domain analysis of an integrated circuit ceramic ball grid array package antenna for single-chip wireless transceivers,” IEEE Transactions on Antennas and Propagation, Vol. 52, No. 2, pp. 435-442, February 2004.

26. Wei Wang, Y. P. Zhang, “0.18-mm CMOS push-pull power amplifier with antenna in IC package,” IEEE Microwave and Wireless Components Letters, Vol. 14, No. 1, pp. 13-15, January 2004.

27. Y. P. Zhang, “BER performance of intra-chip wireless interconnect systems,” IEEE Communications Letters, Vol. 8, No. 1, pp. 39-41, January 2004.

28. C. C. Zhang, J. J. Liu, Y. P. Zhang, “ICPA for highly integrated concurrent dual-band wireless receivers,” Electronics Letters, Vol. 39, No. 12, pp. 887-889, 2003.

29. Y. P. Zhang, “Integration of microstrip antenna on cavity-down ceramic ball grid array package,” Electronics Letters, Vol. 38, No. 22, pp. 1307-1308, 2002.

30.  Y. P. Zhang, “Integration of dual-mode RF bandpass filter on ceramic ball grid array package,” Electronics Letters, Vol. 38, No. 19, pp. 1106-1107, 2002.

31. Y. P. Zhang, “Integration of microstrip antenna on ceramic ball grid array package,” Electronics Letters, Vol. 38, No. 1, pp. 14-16, 2002.

    　

          Presentations

1.        Q. Li, “Design of A CMOS Ultra-Wideband (UWB) Receiver,” First Year Presentation, February 2004.

2.         M. Sun, “A Study of Chip Scale Wireless Interconnect Systems,” First Year Presentation, August 2004.

3.         Z. M. Chen, “A Study of Inter-chip Wireless Interconnect System,” First Year Presentation, December 2005.

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        Patents

1.  Inter- and intra-chip wireless communications system filed US patent on  03/10/2003.

2.  Integrating an antenna and a filter in the housing of a device package filed Singapore patent on 22/10/2003 and US patent on 21/10/2004.

3.  Ultrawide-Band (UWB) integrated circuit package antenna technology, NTU Ref: TD/066/05, Application date: 20/10/2005.

4.  Inductorless UWB LNA IC design with noise cancellation filed US patent on 04/10/2006.

5.  20 GHz high frequency CMOS T/R switch IC design filed US patent on 21/09/2006.