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Last updated: 16-10-2006

          Poems

˰岁约礼

驰骋异洣ͣ渐宽随顿գϴ兴盎ԣ͵գ触ף诚诚ʦ约礼凤辈ݾ风亣锦绣Ҵ华

Ҵ岁学

观郎

۰脉艳

励Ҵ

抖擞ذ闲

ݹ׺学训

东荆红

归ʫ

ߣ沉鸟轻

ܡ鱼

ϴ难

Ҵ学获学

风赋

风离

红叶随

͵

ʰ声

风泪

两总

长别

儿ҳ长׫

Ҵ构

轻矫飞

惊涛汹闲

ݳ翘觅

阳艳

绚丽涟漪

众Ӯ头

朵声甜

Ҵ记

˰清风

ٺؼ悦邻

宾梦

数尽风׵傥

ߣ绿旷细濛

ʰ声ͺ园

异乡

谁˭

Ҵ圣诞晚会

ߣ

˰润

ܡ戏澜

绿树浓荫骄阳

黄叶满ߣ

胧窗

细觉

遥鸳鸯

Ҵ怀

怀乡

处龙

͵ءߣ

鸡鸣

咏华

鸿图过关

长别

马兰类转

悦儿还ͺ乡٥

Ҵ学

ʰ

奥运ʰ

几残泪

骚狮

辈̭

声尽

ݹ׺学训

婀红

枪战к

见时观

ҳ胜

ݹ׺学训

          Papers

  1. Y. P. Zhang, M. Swaminathan, RF and microwave subsystem modules for wireless communications, Editorial, International Journal of RF and Microwave Computer-Aided Engineering, May 2006. 

  2. Y. P. Zhang, Integration of antenna on IC package: An elegant antenna solution to single-chip radio, Keynote Address at Antenna Systems and Short-Range Wireless Conference, September 22-23, 2005, Santa Clara, CA. USA. 

  3. Y. P. Zhang, Antenna-in-package (AiP) technology for modern radio systems, Invited Address at IEEE Workshop on Antenna Technology, March 6-8, 2006, New York, USA.

  4. Y. P. Zhang, Z. M. Chen, M. Sun, J. He, Wireless chip area network (WCAN): A new paradigm for RF microelectronics and radio communications, Invited Address at IEEE Workshop on Electrical Design of Advanced Packaging and Systems to be held from 16-18 December 2006, Shanghai, China.   

  5. Y. P. Zhang, Underground propagation, Invited Chapter of Wileys Encyclopedia of RF and Microwave Engineering, Vol. 6, pp. 5423-5433.

  6. M. Z. Tong, Y. P. Zhang, Y. L. Lu, Design and analysis of integrated-circuit package antennas (ICPA) and filters (ICPF) for highly integrated wireless transceivers, Invited Chapter of Research Signposts Signal Integrity Engineering for Integrated Microwave and High Speed Circuits.

  7. Y. P. Zhang Design and experiment of differentially-driven microstrip antennas, to appear in IEEE Transactions on Antennas and propagation, 2007.

  8. Y. P. Zhang, Qiang Li, Performance of UWB impulse radio with planar monopoles over on-human-body propagation channel for wireless body area networks, Revised for IEEE Transactions on Antennas and Propagation.

  9. Andrew Poh, Y. P. Zhang, Design and analysis of transmit/receive switch in triple-well CMOS for MIMO wireless systems, to appear in IEEE Transactions on Microwave Theory and Techniques, 2007.

  10. Q. Li, Y. P. Zhang, A 1.5-V 2–9.6-GHz Inductor-less Low-Noise Amplifier in 0.13-µm CMOS, to appear in IEEE Journal of Solid-State Circuits. 

  11. Z. M. Chen, Y. P. Zhang, Inter-Chip Wireless Communication Channel: Measurement, Characterization, and Modeling, to appear in IEEE Transactions on Antennas and Propagation.

  12. Q. Li, Y. P. Zhang, CMOS T/R switch design: towards ultrawide-band and higher frequency, to appear in IEEE Journal of Solid-State Circuits.  This is the first regular paper that has ever been accepted up to now by this IEEE Flagship Journal from NTU and the second from Singapore.

  13. Y. P. Zhang, M. Sun, Dual-band microstrip bandpass filter using stepped impedance resonators with new coupling schemes, IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 10, pp. 3779-3785, October 2006. This was  one of the top 100 accessed papers from the IEEE Xplore in October 2006.

  14.  Y. P. Zhang, Q. Li, W. Fan, C. H. Ang, H. Li, A differential CMOS T/R switch for multi-standard applications, IEEE Transactions on Circuits and Systems II,  Vol. 53, No. 8, pp. 782-786, August 2006.

  15. Y. P. Zhang, L. H. Guo, M. Sun, High transmission gain inverted-F antenna on low resistivity Si for wireless interconnect, IEEE Electron Device Letters, Vol. 27, No. 5, pp. 374-376, May 2006.

  16. Y. P. Zhang, X. J. Li, A. Phang, A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers, IEEE Transactions on Advanced Packaging, Vol. 29, No. 2, pp. 354-358, May 2006.

  17. Y. J. Zheng, Y. P. Zhang, Y. Tong, A novel wireless interconnect technology using impulse radio for inter-chip communications, IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 4, pp. 1912-1920, April 2006.

  18. Y. P. Zhang, J. J. Wang, Theory and analysis of differentially-driven microstrip antennas, IEEE Transactions on Antennas and propagation, Vol. 54, No. 4, pp. 1092-1099, April 2006.

  19. J. J. Wang, Y. P. Zhang, C. W. Lu, K. M. Chua, Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers, IEEE Transactions on Antennas and Propagation, Vol. 53, No. 12, pp. 3877-3883, December 2005.

  20. M. Sun, Y. P. Zhang, Performance of inter-chip RF-interconnect using CPW, capacitive coupler and UWB transceivers, IEEE Transactions on Microwave Theory and Techniques, Vol. 53, No. 9, pp. 2650-2655, September 2005. This was one of the top 50 downloaded papers from the MTT 2005 (Source: MTT Editor-in-Chief, Editorial, June Issue 2006). This was also one of the top 100 accessed papers from the IEEE Xplore in September 2005.

  21.  Y. Chen, Y. P. Zhang, A planar antenna in LTCC for single-package UWB radio, IEEE Transactions on Antennas and Propagation, Vol. 53, No. 9, pp. 3089-3093, September 2005.

  22. Y. P. Zhang, M. Sun, L.H. Guo, On-chip antennas for 60 GHz radios in silicon technology, IEEE Transactions on Electron Devices, Vol. 52, No. 7, pp. 1664-1668, July 2005.

  23. Y. P. Zhang, Integrated circuit ceramic ball grid array package antenna, IEEE Transactions on Antennas and Propagation, Vol. 52, No. 10, pp. 2538-2544, October 2004.

  24.  Y. Chen, Y. P. Zhang, Integration of ultra-wideband slot antenna on LTCC substrate,  Electronics Letters, Vol. 40, No. 11, pp. 645-646, May 2004.

  25. Y. P. Zhang, Finite-difference time-domain analysis of an integrated circuit ceramic ball grid array package antenna for single-chip wireless transceivers, IEEE Transactions on Antennas and Propagation, Vol. 52, No. 2, pp. 435-442, February 2004.

  26. Wei Wang, Y. P. Zhang, 0.18-mm CMOS push-pull power amplifier with antenna in IC package, IEEE Microwave and Wireless Components Letters, Vol. 14, No. 1, pp. 13-15, January 2004.

  27. Y. P. Zhang, BER performance of intra-chip wireless interconnect systems, IEEE Communications Letters, Vol. 8, No. 1, pp. 39-41, January 2004.

  28. C. C. Zhang, J. J. Liu, Y. P. Zhang, ICPA for highly integrated concurrent dual-band wireless receivers, Electronics Letters, Vol. 39, No. 12, pp. 887-889, 2003.

  29. Y. P. Zhang, Integration of microstrip antenna on cavity-down ceramic ball grid array package, Electronics Letters, Vol. 38, No. 22, pp. 1307-1308, 2002.

  30.  Y. P. Zhang, Integration of dual-mode RF bandpass filter on ceramic ball grid array package, Electronics Letters, Vol. 38, No. 19, pp. 1106-1107, 2002.

  31. Y. P. Zhang, Integration of microstrip antenna on ceramic ball grid array package, Electronics Letters, Vol. 38, No. 1, pp. 14-16, 2002.

          Presentations

1.        Q. Li, Design of A CMOS Ultra-Wideband (UWB) Receiver, First Year Presentation, February 2004.

2.         M. Sun, A Study of Chip Scale Wireless Interconnect Systems, First Year Presentation, August 2004.

3.         Z. M. Chen, A Study of Inter-chip Wireless Interconnect System, First Year Presentation, December 2005.

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        Patents

1.  Inter- and intra-chip wireless communications system filed US patent on  03/10/2003.

2.  Integrating an antenna and a filter in the housing of a device package filed Singapore patent on 22/10/2003 and US patent on 21/10/2004.

3.  Ultrawide-Band (UWB) integrated circuit package antenna technology, NTU Ref: TD/066/05, Application date: 20/10/2005.

4.  Inductorless UWB LNA IC design with noise cancellation filed US patent on 04/10/2006.

5.  20 GHz high frequency CMOS T/R switch IC design filed US patent on 21/09/2006.