WCM2003 has a relatively complete coverage of 15 major compact models/interfaces.  It involves participation of 13 countries/regions all over the world from 34 institutions (17 academic, 17 industry).  The full 3-day event includes 22 Invited Papers, a Forum on "the role of compact model in the fab and fabless business" followed by an evening Panel Discussion with a distinguished 8 panelists from major representative academic, chip industry, and EDA vendors, a contributed Poster Session with 13 oral briefings, and 2 Tutorials.  Being the second Workshop, WCM has become a major event in the CM field and is positioning itself to be a truly open forum for the modeling/technology/design communities.

The main highlights of WCM2003 are the major compact models that are currently widely used or being developed, as demonstrated by the invited papers/tutorials.  As suggested at the first WCM2002, the topics are also extended to include bipolar, double-gate, extrinsic/passive-element, as well as parameter extraction and simulator interface, in addition to the core intrinsic MOS models.  With major academia/industry/vendor representatives this year, the evening Panel Discussion involves interesting "spirited difference of opinions" on how to define, develop, and deploy a good compact model, preceded by a special Forum session, with each panelist to bring out his views on the role of compact model in the fab and fabless business.  The contributed Poster session covers wide range of topics and, for the first time, poster papers are presented with a 5-minute Oral Briefing.

The success of WCM lies on the enthusiastic participation and contribution of all the people involved collectively as one community sharing the same vision and goal, so does the future of the WCM.

Xing Zhou
March 6, 2003
Singapore
 

• Represented models: (15)

ACM, ADMS, BSIM, EKV, HICUM, HiSIM, Mextram, MOS11, SEQUEL, SP, UFDG, USIM, VBIC, Verilog-A, Xsim

• Participation by countries/regions: (13)

Belgium, Brazil, Germany, Hong Kong, India, Japan, Korea, Poland, Singapore, Switzerland, Taiwan, The Netherlands, USA

• Participation by affiliations: (34)
• Academia (17): EPFL, Hiroshima, HKUST, IIT-Bombay, KAIST, NTU, Penn State Univ, Santa Clara Univ, Stanford Univ, SUNY Stony-Brook, TU Lodz, UC Berkeley, UC San Diego, UFSC, Univ Antwerp, Univ Florida, UT Dresden
• Industry (17): Agere, AMD, AMS, Cadence, CSEM, CSM, IBM, Intel, LSI Logic, Mentor Graphics, Motorola, NIAIST, NNDL, Philips, Synopsys, Tiburon, TSMC

• Invited papers, contributed posters, and tutorials:

There are 22 invited papers, 14 contributed posters, and 2 tutorials presented at the WCM2003.

• Forum & Panel discussion:
• Panelists (8): A Forum and an Evening Panel discussion are organized, with experts from academia (Stanford, UC Berkeley), chip industry (Intel, LSI Logic, Philips), and EDA vendors (Cadence, Mentor Graphics, Synopsys)