VLSI Technology and Circuits Technical Committee |
Workshop on Compact Modeling (WCM-MSM2003) |
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WCM
MSM2003 |
Workshop on Compact Modeling at the 6th International Conference on Modeling and Simulation of Microsystems | |
Date
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February 25-27, 2003 | |
Venue | Grand Hyatt San Francisco
San Francisco, California, USA |
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Synopsis | Compact Models
(CMs) for circuit simulation have been at the heart of CAD tools for circuit
design over the past decades, and are playing an ever increasingly important
role in the very-deep-submicron/system-on-chip (VDSM/SOC) era. As
the mainstream MOS technology is scaled into the VDSM regime, development
of a truly physical and predictive compact model for circuit simulation
that covers geometry, bias, temperature, DC, AC, RF, and noise characteristics
becomes a major challenge.
Workshop on Compact Modeling (WCM) is one of the first of its kind in bringing people in the CM field together. The objective of WCM is to create a truly open forum for discussion among experts in the field as well as feedback from technology developers, circuit designers, and CAD tool vendors. For WCM-MSM2003, it is planned to have an Invited-Speaker Session, an Evening Forum on "Model development - industry requirement dialogue", contributed Poster Session as well as Tutorial Session. The topics are extended to the following areas, within the main theme - compact models for circuit simulation:
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Invited Speakers | Invited speakers
as well as panelists for the WCM Forum from all over the world (10 countries)
are listed below (speakers
underlined):
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Workshop
Program |
There are
22 invited papers, which are categorized in the following topic areas (speakers
underlined):
Compact modeling and design:
Robert Dutton and Chang-Hoon Choi, Stanford University, USA Eric Vittoz, Christian Enz, and Francois Krummenacher*, Swiss Center for Electronics and Microtechnology, *EPFL, Switzerland
Averill Bell, Kumud Singhal, and Hermann Gummel, Agere Systems, USA Carlos Galup-Montoro, M. C. Schneider, A. I. A. Cunha*, and O. C. Gouveia-Filho**, Universidade Federal de Santa Catarina, *Escola Politécnica/UFBA - Salvador, **CIEL/UFPR - Curitiba, Brazil Mitiko Miura-Mattausch, D. Navarro, H. Ueno, H. J. Mattausch, K. Morikawa*, S. Itoh*, A. Kobayashi*, and H. Masuda*, Hiroshima University, *Semiconductor Technology Academic Research Center, Japan Jin He, Xuemei Xi, Mansun Chan*, Ali Niknejad, and Chenming Hu, University of California at Berkeley, USA, *Hong Kong University of Science and Technology, Hong Kong Xing Zhou, Siau Ben Chiah, and Khee Yong Lim*, Nanyang Technological University, *Chartered Semiconductor Manufacturing, Singapore
Mansun Chan, Yuan Taur*, Chung Hsun Lin**, Jin He**, Ali Niknejad**, and Chenming Hu**, Hong Kong University of Science and Technology, Hong Kong, *University of California at San Diego, **University of California at Berkeley, USA Jerry Fossum, Lixin Ge, and Meng-Hsueh Chiang, University of Florida, USA
Colin McAndrew, Motorola, USA Michael Schroter, University of Technology Dresden, Germany
A. J. Scholten, L. F. Tiemeijer, R. van Langevelde, R. J. Havens, A. T. A. Zegers-van Duijnhoven, V. C. Venezia, and Dirk Klaassen, Philips Research Laboratories, The Netherlands Hyungcheol Shin, Jeonghu Han, and Minkyu Je, Korea Advanced Institute of Science and Technology, Korea
Narain Arora, Cadence Design Systems, USA Ali Niknejad, Mansun Chan*, Chenming Hu, Xuemei Xi, Jin He, Pin Su, Yu Cao, Hui Wan, Mohan Dunga, Chinh Doan, Sohrab Emami, and Chung-Hsun Lin, University of California at Berkeley, USA, *Hong Kong University of Science and Technology, Hong Kong Andrea Pacelli, State University of New York at Stony Brook, USA Sang-Pil Sim and Cary Yang, Santa Clara University, USA Niranjan Talwalkar, Patrick Yue, and Simon Wong, Stanford University, USA
Xin Gu, Gennady Gildenblat,Glen Workman*, and Shye Shapira**, Pennsylvania State University, *Motorola, **Agere Systems, USA
Thomas Gneiting, Advanced Modeling Solutions, Germany
Laurent Lemaitre, Colin McAndrew*, and Wladyslaw Grabinski, Motorola, Switzerland, *Motorola, USA Marek Mierzwinski and Robert Dutton*, Tiburon Design Automation, *Stanford University, USA |
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Forum and Evening Panel | Forum on Model
development - industry requirement dialogue
Continued from the first successful Workshop on Compact Modeling (WCM-MSM2002) in San Juan, April 2002, this second Workshop (WCM-MSM2003) encompasses a broader range of topics, from intrinsic bulk MOS to bipolar and SOI/double-gate, as well as RF/interconnect/extrinsic/passive-element models, covering important issues on design considerations, parameter extraction, and simulator interface. To complement the invited technical presentations by experts from both academia and industry, a Forum on "model development - industry requirement dialogue" is organized, in which we are going to hear experts' views on the general topic: An Evening Panel discussion
will be followed by a panel of experts from major representative academic
(Stanford, UC Berkeley), chip industry (Intel, LSI Logic, Philips), and
EDA vendors (Cadence, Mentor Graphics, Synopsys). The Panel will
discuss important topics that are in line with the theme of this Workshop:
We are expected to hear "spirited difference of opinions" on how to define, develop, and deploy a good compact model that is central to the mutual benefit of the entire chip design, modeling, and manufacturing communities. |
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Moderator | Narain Arora, Cadence Design Systems, USA | |
Panelists |
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Poster Session | Poster presentations
in the scope of "compact models for circuit simulation" are solicited.
A 5-minute oral briefing for each poster paper is planned before
the poster presentation session.
Contributed poster papers are listed below (presenters underlined):
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Tutorial Session | Two tutorials
are offered as listed below (speakers
underlined):
Jeroen Paasschens and R. van der Toorn, Philips Research Laboratories, The Netherlands in a Circuit Simulator Mahesh Patil, Indian Institute of Technology - Bombay, India |
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Presentation
Slides |
click
here
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Websites for Proceedings | http://www.nsti.org/procs/Nanotech2003v2/7
(Vol. 2, Chapter 7: Compact Modeling) |
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WCM-MSM2003
official websites |
http://www.cr.org/MSM2003/WCM.html
http://www.nanotech2003.com/WCM2003.html http://www.nsti.org/WCM2003.html |
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Click to download the program (PDF) |
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