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Objective The objective of the Compact Modeling Technical Committee is to objectively identify, examine, and evaluate current models for active and passive components used for circuit simulation.  The emphasis is on models for the components / interconnects required for chip design, and therefore this committee will attempt to work closely with the Solid-State Circuits Society.
Membership This is a non-voting Ex-Officio AdCom member position with a two-year renewable term.  The committee was first set up in February 2001, chaired by Dr. Narain Arora.
Operation This committee operates entirely by email.  There are two Society AdCom meetings a year, with one meeting always being held in conjunction with IEDM.  The other AdCom meeting is normally held sometime in the April-June time period in conjunction with another EDS sponsored conference.  For 2009, the dates and locations of the two AdCom meetings are as follows:
Dates Meeting Locations
30/31 May 2009 IEDST IIT-Bombay, Mumbai, India
5/6 Dec 2009 IEDM Baltimore, MD, USA
Contact If you have ideas or information related to compact models for circuit simulation, please contact the committee members.  If you would like to volunteer in the committee, please contact Prof. Jamal Deen.  For comments on this website, please contact Dr. Xing Zhou.
Jamal Deen 
Electrical and Computer Engineering
McMaster University
1280 Main St. West
Hamilton, Ontario L8S 4K1, Canada
Tel: +1 905-525-9140
Fax: +1 905-523-4407 
Xing Zhou 
School of Electrical & Electronic Eng. 
Nanyang Technological University 
Block S1, Nanyang Ave. 
Singapore 639798 
Tel: +65 6790-4532 
Fax: +65 6791-2687 

Any comments/ideas/suggestions related to the field of VLSI device/circuit/interconnect compact modeling are welcome!