||The objective of the Compact Modeling
Technical Committee is to objectively identify, examine, and evaluate
current models for active and passive components used for circuit simulation.
The emphasis is on models for the components / interconnects required for
chip design, and therefore this committee will attempt to work closely
with the Solid-State Circuits
||This is a non-voting Ex-Officio AdCom member position with a two-year
renewable term. The committee was first set up in February 2001,
chaired by Dr. Narain Arora.
||This committee operates entirely by email. There are two Society
AdCom meetings a year, with one meeting always being held in conjunction
with IEDM. The other AdCom meeting is normally held sometime in the
April-June time period in conjunction with another EDS sponsored conference.
For 2009, the dates and locations of the two AdCom meetings are as follows:
|30/31 May 2009
||IIT-Bombay, Mumbai, India
|5/6 Dec 2009
||Baltimore, MD, USA
||If you have ideas or information related to compact models for circuit
simulation, please contact the committee members.
If you would like to volunteer in the committee, please contact Prof. Jamal
Deen. For comments on this website, please contact Dr. Xing Zhou.
Electrical and Computer Engineering
1280 Main St. West
Hamilton, Ontario L8S 4K1, Canada
Tel: +1 905-525-9140
Fax: +1 905-523-4407
School of Electrical & Electronic Eng.
Nanyang Technological University
Block S1, Nanyang Ave.
Tel: +65 6790-4532
Fax: +65 6791-2687
Any comments/ideas/suggestions related to the field of VLSI device/circuit/interconnect
compact modeling are welcome!