Z.W. Zhong, Doctor
of Engineering
Associate
Professor
School
of Mechanical & Aerospace Engineering
50
Nanyang Avenue, Singapore 639798
Room : N3-02C-98 Phone
: (65) 6790 5588
E-mail : mzwzhong@ntu.edu.sg
Web page: http://www.ntu.edu.sg/home/mzwzhong/
My
TEACHING
· M6304,
Ultraprecision & Micromachining Processes, Post-graduate (Masters and PhD)
course, Lecture
· M6301, Advanced
Metrology and Sensing Systems, Post-graduate (Masters and PhD) course, Lecture
· MA2002, Theory of
Mechanisms, Under-graduate 2nd year
course, Lecture
& Tutorial
MAIN
RESEARCH INTERESTS
Mechatronics and Design; Manufacturing (precision and ultra-precision
engineering, microelectronics packaging); Modelling and Analyses, Air Traffic Management
1.
S Shamsudin, MA Lajis, ZW Zhong, Solid-state recycling of light metals: A
review, Advances in Mechanical Engineering 8(8)
(2016) 1-23. DOI:
10.1177/1687814016661921 Open Access: http://ade.sagepub.com/content/8/8/1687814016661921.full.pdf+html (pdf)
2.
Chee, KY; Zhong, ZW. Control, navigation and collision avoidance for an unmanned aerial
vehicle, SENSORS AND ACTUATORS A-PHYSICAL, Volume: 190, Pages: 66-76,
2013. (pdf)
3.
Chauhan, Preeti; Zhong, Z. W.; Pecht, Michael. Copper
Wire Bonding Concerns and Best Practices, JOURNAL OF ELECTRONIC
MATERIALS, Volume: 42, Issue: 8, Pages: 2415-2434, 2013. (pdf)
4.
Zhong, ZW; Wang, ZP; Huang, GXD. Investigation of wax and paper materials for the fabrication of
paper-based microfluidic devices, MICROSYSTEM TECHNOLOGIES-MICRO-AND
NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, Volume: 18, Issue: 5,
Pages: 649-659, 2012. (pdf)
5.
Zhong, ZW; Shan, XC. Microstructure formation via roll-to-roll UV embossing using a flexible
mould made from a laminated polymer-copper film, JOURNAL OF
MICROMECHANICS AND MICROENGINEERING, Volume: 22, Issue: 8, Article Number:
085010, 2012. (pdf)
6.
Zhong, ZW. Overview
of wire bonding using copper wire or insulated wire, MICROELECTRONICS RELIABILITY,
Volume: 51, Issue: 1, Pages: 4-12, 2011. (pdf)
7.
Zhong, ZW; Shan, XC; Wong, SJ. Roll-to-roll large-format slot die coating of photosensitive resin for UV
embossing, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION
STORAGE AND PROCESSING SYSTEMS, Volume: 17, Issue: 12, Pages: 1703-1711, 2011.
(pdf)
8.
Zhong, ZW; Song, B; Loh, RE. LCAs of a polycrystalline photovoltaic module and a wind turbine, RENEWABLE
ENERGY, Volume: 36, Issue: 8, Pages: 2227-2237, 2011. (pdf)
9.
Zhong, ZW; Leong, MH; Liu, XD. The wear rates and performance of three mold insert materials, MATERIALS & DESIGN,
Volume: 32, Issue: 2, Pages: 643-648, 2011. (pdf)
10. Zhong, ZW; Shan, XC;
Yao, YC. Investigation of Antiadhesive
Coatings for Nanoimprinting Lithography, MATERIALS AND MANUFACTURING
PROCESSES, Volume: 25, Issue: 7, Pages: 658-664, 2010. (pdf)
11. Zhong, ZW; Song, B; Zaki, MBM. Life-cycle
assessment of flash pyrolysis of wood waste, JOURNAL OF CLEANER
PRODUCTION, Volume: 18, Issue: 12, Pages: 1177-1183, 2010. (pdf)
12. Zhong, ZW; Venkatesh, VC. Recent
developments in grinding of advanced materials, INTERNATIONAL JOURNAL OF
ADVANCED MANUFACTURING TECHNOLOGY, Volume: 41, Issue: 5-6, Pages: 468-480,
2009. (pdf)
13. Zhong, ZW. Wire bonding using copper wire, MICROELECTRONICS
INTERNATIONAL, Volume: 26, Issue: 1, Pages: 10-16, 2009. (pdf)
14. Zhong, ZW; Song, B;
Huang, CX. Environmental Impacts of
Three Polyhydroxyalkanoate (PHA) Manufacturing
Processes, MATERIALS AND MANUFACTURING PROCESSES, Volume: 24, Issue: 5,
Pages: 519-523, Article Number: PII 909441709, 2009. (pdf)
15. Zhong, ZW. Recent advances in polishing of advanced
materials, MATERIALS AND MANUFACTURING PROCESSES, Volume: 23, Issue: 5,
Pages: 449-456, 2008. (pdf)
16. Nah, SK; Zhong, ZW. A microgripper
using piezoelectric actuation for micro-object manipulation, SENSORS AND
ACTUATORS A-PHYSICAL, Volume: 133, Issue: 1, Pages: 218-224, 2007. (pdf)
17. Zhong, ZW; Peng, ZF;
Liu, N. Surface roughness
characterization of thermally sprayed and precision machined WC-Co and
Alloy-625 coatings, MATERIALS CHARACTERIZATION, Volume: 58, Issue: 10,
Pages: 997-1005, 2007. (pdf)
18. Goh, KS; Zhong, Z W. Two capillary solutions for ultra-fine-pitch
wire bonding and insulated wire bonding, MICROELECTRONIC ENGINEERING,
Volume: 84, Issue: 2, Pages: 362-367, 2007. (pdf)
19. Zhong, ZW; Ho, HM;
Tan, YC; Tan, WC; Goh, HM; Toh, BH; Tan, J. Study of factors affecting the hardness of
ball bonds in copper wire bonding, MICROELECTRONIC ENGINEERING, Volume:
84, Issue: 2, Pages: 368-374, 2007. (pdf)
20. Zhong, ZW; Chan, SY. Investigation of a gripping device actuated
by SMA wire, SENSORS AND ACTUATORS A-PHYSICAL, Volume: 136, Issue: 1,
Pages: 335-340, 2007. (pdf)
21. Zhong, ZW; Khoo, LP; Han, ST. Prediction
of surface roughness of turned surfaces using neural networks, INTERNATIONAL
JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 28, Issue: 7-8, Pages:
688-693, 2006. (pdf)
22. Zhong, ZW; Zhao, LP;
Lin, HH. Development and investigation
of an optical tilt sensor, OPTICS COMMUNICATIONS, Volume: 261, Issue: 1,
Pages: 23-28, 2006. (pdf)
23. Zhong, ZW; Goh, KS. Investigation of ultrasonic vibrations of
wire-bonding capillaries, MICROELECTRONICS JOURNAL, Volume: 37, Issue:
2, Pages: 107-113, 2006. (pdf)
24. Arulvanan, P; Zhong, ZW; Shi,
XQ. Effects of process conditions on
reliability, microstructure evolution and failure modes of SnAgCu
solder joints, MICROELECTRONICS RELIABILITY, Volume: 46, Issue: 2-4,
Pages: 432-439, 2006. (pdf)
25. Zhong, ZW; Lin, G. Ultrasonic assisted turning of an aluminium-based
metal matrix composite reinforced with SiC particles,
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 27,
Issue: 11-12. Pages: 1077-1081, 2006. (pdf)
26. Zhong, ZW; Wang, ZF;
Tan, YH. Chemical mechanical polishing
of polymeric materials for MEMS applications, MICROELECTRONICS JOURNAL,
Volume: 37, Issue: 4, Pages: 295-301, 2006. (pdf)
27. Arulvanan, P; Zhong, ZW. Assembly and reliability of PBGA packages on
FR-4 PCBs with SnAgCu solder, MICROELECTRONIC
ENGINEERING, Volume: 83, Issue: 11-12, Pages:
2462-2468, 2006. (pdf)
28. Tan, J; Zhong, ZW;
Ho, HM, Wire-bonding process
development for low-k materials, MICROELECTRONIC ENGINEERING, Volume:
81, Issue: 1, Pages: 75-82, 2005. (pdf)
29. Zhong, ZW. Various adhesives for flip chips, JOURNAL
OF ELECTRONIC PACKAGING, Volume: 127, Issue: 1, Pages: 29-32, 2005. (pdf)
30. Zhong, ZW; Yang, HB. Development of a vibration device for
grinding with microvibration, MATERIALS AND
MANUFACTURING PROCESSES, Volume: 19, Issue: 6, Pages: 1121-1132, 2004. (pdf)
31. Zhong, ZW. Ductile or partial ductile mode machining of
brittle materials, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING
TECHNOLOGY, Volume: 21, Issue: 8, Pages: 579-585, 2003. (pdf)
32. Zhong, ZW. Grinding of aluminium-based metal matrix
composites reinforced with Al2O3 or SiC
particles, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,
Volume: 21, Issue: 2, Pages: 79-83, 2003. (pdf)
33. Gan, J; Wang, X; Zhou,
M; Ngoi, B; Zhong, Z. Ultraprecision diamond turning of glass with ultrasonic vibration, INTERNATIONAL
JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 21, Issue: 12, Pages:
952-955, 2003. (pdf)
34. Zhong, Z; Yip, PK. Finite element analysis of a
three-dimensional package, SOLDERING & SURFACE MOUNT TECHNOLOGY,
Volume: 15, Issue: 1, Pages: 21-25, 2003. (pdf)
35. Zhong, ZW; Tok, WH. Grinding
of single-crystal silicon along crystallographic directions, MATERIALS
AND MANUFACTURING PROCESSES, Volume: 18, Issue: 5, Pages: 811-824, 2003. (pdf)
36. Zhong, ZW; Nah, SK. Thermal strain analysis of an electronics
package using the SEM Moire technique, SOLDERING
& SURFACE MOUNT TECHNOLOGY, Volume: 15, Issue: 3, Pages: 33-35, 2003. (pdf)
37. Chan, KC; Teo, M;
Zhong, ZW. Characterization of low-k benzocyclobutene dielectric thin film, MICROELECTRONICS
INTERNATIONAL, Volume: 20, Issue: 3, Pages: 11-22, 2003. (pdf)
38. Zhong, ZW; Han, ZZ. Turning of glass with abrasive waterjet, MATERIALS
AND MANUFACTURING PROCESSES, Volume: 17, Issue: 3, Pages: 339-349, 2002. (pdf)
39. Zhong, ZW; Hung, NP, Grinding of alumina/aluminum
composites, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, Volume: 123,
Issue:1, Pages: 13-17, Article Number: PII
S0924-0136(02)00075-4, 2002. (pdf)
40. Xie, HM; Asundi, A; Boay, CG; Lu, YG; Yu, J;
Zhong, ZW; Ngoi, BKA. High resolution AFM scanning Moire method and
its application to the micro-deformation in the BGA electronic package, MICROELECTRONICS RELIABILITY, Volume: 42, Issue: 8, Pages: 1219-1227,
Article Number: PII S0026-2714(02)00084-7, 2002. (pdf)
41. Zhong, ZW. Surface finish of precision machined advanced
materials, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, Volume: 122,
Issue: 2-3, Pages: 173-178, 2002. Article Number: PII S0924-0136(02)00076-6. (pdf)
42. Lu, YG; Zhong, ZW;
Yu, J; et al. Thermal deformation
measurement of electronic packages using the atomic force microscope scanning moire technique, REVIEW OF SCIENTIFIC INSTRUMENTS,
Volume: 72, Issue: 4, Pages: 2180-2185, 2001. (pdf)
43. Zhong, ZW; Goh, KS. Analysis and experiments of ball
deformation for ultra-fine-pitch wire bonding, JOURNAL OF ELECTRONICS
MANUFACTURING, Volume: 10, Issue: 4, Pages: 211-217, 2000. (pdf)
44. Zhong, ZW; Hung, NP. Diamond turning and grinding of aluminum-based metal matrix composites, MATERIALS
AND MANUFACTURING PROCESSES, Volume: 15, Issue: 6, Pages: 853-865, 2000. (pdf)
45. Hung, NP; Tan, TC;
Zhong, ZW; et al. Ductile-regime
machining of particle-reinforced metal matrix composites, MACHINING
SCIENCE AND TECHNOLOGY, Volume: 3, Issue: 2, Pages:255-271, 1999. (pdf)
46. Zhong, Z; Nakagawa,
T. Grinding of aspherical SiC mirrors, JOURNAL OF MATERIALS PROCESSING
TECHNOLOGY, Volume: 56, Issue: 1-4, Pages: 37-44, 1996. (pdf)
47. Zhong, ZW; Nakagawa,
T. Development of a micro-displacement
table for ultra-precision machining and grinding for curved surfaces by the use
of it, INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION
ENGINEERING, Volume: 26, Issue: 2, Pages: 102-107, 1992. (pdf)
OTHER
INFORMATION
·
Lian He Zao Bao (Newspaper in Singapore, 12 July 2005) reported that my PhD student
set a new NTU record to obtain a PhD degree in 2 years, the minimal time
required.