Patents

Patents
1.	Leong Wei Lin; Lee Pooi See; Lam Yeng Ming; Song Lixin; Ebinazar Benjamin Namdas; Subodh G. Mhaisalkar, “Synthesis, Design, and Method of Forming Nanostructure-Based Organic Floating Gate Memory Devices.” US Provisional Patent Application Filed by A*STAR on 22 May 2006
2.	Ebinazar Benjamin Namdas; Tommy Cahyadi; Subodh G. Mhaisalkar; Lee Pooi See; Chen Zhikuan; Lam Yeng Ming; Song Lixin, “Solution processed Inorganic films as gate dielectric for organic thin films transistors (OTFT),” US Provisional Patent Application Filed by A*STAR On 22 May 2006
3.	A. Asundi, A. Priyadarshi, and S. G. Mhaisalkar, “Moiré Interferometric Strain Sensor,” US Patent Filed, NTU Ref: PAT/026/05/05/US.
4.	S.P. Lau, M. Cholewa, G-C. Yi, J.K. Yoo, A.P. Burden, L. Huang, X.Y. Gao, T.S.A. Wee, H.O. Moser, “Radiation detector having coated nanostructure and method’, filed in US patent office on 13 May 2005
5.	Xun GUO, Mary B. CHAN-PARK, Soon Fatt YOON, Jung-Hoon CHUN, Method to Fabricate Microfeatures with Continuous Relief, US Provisional Patent Filed March 21, 2005 (Assignee: NTU and MIT)
6.	US Patent 6,867,898 (March 15, 2005) Electrophoretic display and novel process for its manufacture. Inventors: R. C. Liang, M. Chan-Park, S. C.-J. Tseng, G. Wu and H. M. Zang. Assignee: SiPix Imaging (CA, USA).
7.	US Patent 6,859,302 (Feb 22, 2005) Electrophoretic display and novel process for its manufacture. Inventors: R. C. Liang, M. Chan-Park, S. C.-J. Tseng, G. Wu and H. M. Zang. Assignee: SiPix Imaging (CA, USA).
8.	Pradeep Dixit and Jianmin Miao, “Very High Aspect Ratio Copper Interconnects fabricated by innovative through-wafer copper electroplating”, US Provisional Patent, SRC/P/04068/00/US, 9 November 2005
9.	Wenzhong Li, John Wang, Anthony Zhaohui Zhou, Junmin Xue, Jianmin Miao and Hong Zhu, “Method For Patterning Of Ferroelectric/Piezoelectric Films”, US Provisional Patent Application No. 60/664,048.
10.	Shih-Fu Ling & Xiaoyan Hou, “A Method and Transducers for Translational or Rotational Dynamic Testing of Structures and Materials”, supported by ITTO, NTU to file patent to US Patent Office
11.	Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valery Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, and Zhi Yuan Shane, “Interconnect Structure, Integrated Circuit, and Method for Enhancing Metal/Low-K Interconnect Reliability Using a Protection Layer Having Carbon Nanotubes,” ITTO Ref: PAT/020/06/06/US PRV