|
Tseng, Mitchell M (chair), Hong Kong University
of Science and Technology, Hong Kong
Daniel Berg, Rensselaer Polytechnic Institute, USA
E.A. Elsayed, Rutgers University, USA
Boaz Golany, Technion, Israel
Robert W. Grubbström, Linköping Institute of Technology, Sweden
Larry Y.C. Ho, Harvard University, USA and Tsinghua University,
China
Tinus Pretorius, Univ of Pretoria, South Africa
Ralf Reichwald, Technical University of Munich, Germany
Gavriel Salvendy, Purdue University, USA and Tsinghua University,
China
Ue-Pyng Wen, National Tsing Hua University, Taiwan
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