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Conferences

 

  1. J. Ji, F. Tay and J. Miao, “Micromachined Hollow Microneedle Arrays for Drug Delivery and Biological Sample”, Oral presentation, NSTI Nanotech 2006, Boston, Massachusettes, May 7-11, 2006.

 

  1. Jianmin Miao, Plenary Talk, “MEMS Research in Singapore”, 22nd IEEJ Symposium on Sensors, Micromachines and Applications Systems, 20-21 October 2005, Tokyo, Japan

 

  1. Jianmin Miao, Keynote Talk, “High Aspect Ratio Deep Silicon Micromachining and Its Applications”, Fraunhofer IZM workshop Forum 2005 'be-flexible'', Munich (Germany).

 

  1. Zhihong Wang, Weiguang Zhu, Jianmin Miao, Hong Zhu, Chen Chao, and Ooi Kiang Tan, “Micromachined thick film piezoelectric ultrasonic transducer array”,  TRANSDUCERS, 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul (Korea), June 5-9, 2005.

 

  1. Kaixue Ma, Jianguo Ma, Jianbo Sun, Jianmin Miao, Zhenhai Shao, Masayuki Fujise, “A Novel Silicon-based Planar Miniaturized High Pass Filter”, IEEE AP-S International Symposium on Antennas and Propagation and USNC/URSI National Radio Science Meeting, Washington, DC, USA on July 3-8, 2004.

 

  1. Kiat Choon Teo, Jianmin Miao, Sam Zhang and Wai Kwan Wong, “Electronic Interconnection Via Carbon Nanotube (CNT)”, Invited Paper by ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Wang Zhihong, Chao Chen, Zhu Weiguang and Miao Jianmin, “Piezoelectric Measurement with Surface Scanning Techniques“, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Ciprian Iliescu, Guolin Xu, Francis EH Tay and Jianmin Miao, “SU8 Wafer-To-Wafer Bonding Using Contact Imprinting”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Ciprian Iliescu, Kwong Luck Tan, Francis EH Tay and Jianmin Miao, “Deep Wet and Dry Etching of Pyrex Glass: A Review”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Pradeep Dixit and Jianmin Miao, “Applications of Cu Electroplating in Through Wafer Interconnect Technology for MEMS Packaging”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Lu Yi, J. M. Miao, H. Zhu and J. P. Yang, ” Study On A Piezoelectric Micro-cantilever Fabricated By Multi-layer Film Deposition Process”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Sun Jianbo and Jianmin Miao, “A New Method for Development of Low Loss RF Spiral Inductors”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Feixiang Ke, Jianmin Miao, Guan Leng Tan and Siou Tech Chew, “RF-MEMS Diaphragm Switch for High Power Application”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Chang Ming Li, Jie Gao1, Ling Yu and Jianmin Miao, “Plastic flow-through ELISA array protein chip”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Zhanwei Liu, Huimin Xie, Daining Fang, Changzhi Gu, Yonggang Meng, Weining Wang, Yan Fang, and Jianmin Miao, “Deformation analysis in microstructures and microdevices”, ICMAT 2005, 3-8 July 2005, Singapore

 

  1. C. W. Tan and Jianmin Miao, “Application of Carbon Nanotubes in Vertical Interconnects”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. Bangtao Chen, Jianmin Miao, Wang Shao and Francis E.H. Tay, “High-aspect-ratio SOG Electrostatic Microactuators and Their Application in Hard Disk Drives”, ICMAT 2005, 3-8 July 2005, Singapore.

 

  1. F.E.H. Tay, C. Iliescu, J. Ji and J.M. Miao, “Defect-Free Wet Etching Through Pyrex Glass Using Cr/Au Mask”, DTIP 2005, Montreux, Switzerland, 1-3 June 2005, pp.322-327.

 

  1. C. I. Iliescu, J. Miao, F. E. H. Tay, M. Avram, “Wafer level packaging of pressure sensor using SU-8 photoresist” SPIE International Symposium, Smart Materials, Nano-, and Micro-Smart Systems, 5649-38, Sydney (Australia), Dec 12-15, 2004.

 

  1. Jianmin Miao, “Deep Silicon Micro and Nanomachining: A Unique Technology for MEMS, NEMS and Biochip Fabrication”, The 6th International Symposium on the Advanced Materials (ISAM6) "Current and Future of Parts and Materials Technology for the Next Generation", Invited Paper, 3 December 2004, Busan, Korea.

 

  1. C. Iliescu, M. Avram, J. Miao, F.E.H. Tay, G. Xu, “Two mask process for high aspect ratio inertial sensors with adjustable range”, Proc. Of Int. Semiconductor Conf. (CAS 2004), vol. 1, pp. 263-266, 4-6 of October, 2004, Sinaia, Romania.

 

  1. Jianmin Miao and Jianbo Sun, “Integrated RF MEMS inductors on thick silicon oxide layers fabricated using SiDeox process”, ICSICT, October 18-21, 2004, Beijing (China).

 

  1. Bangtao Chen and Jianmin Miao, “Electrostatic microactuators fabricated using deep RIE and wafer bonding for hard disk drives”, ICSICT, October 18-21, 2004, Beijing (China).

 

  1. Kaixue Ma, Jianguo Ma, Jianbo Sun, Jianmin Miao, Manh Anh Do, Kiat Seng Yeo, “A novel silicon-based CBCPW-fed CBCPS ring resonator”, ICSICT, October 18-21, 2004, Beijing (China).

 

  1. C. Iliescu, F.E.H. Tay, J. Jing and J.M. Miao, "Deep Wet Etching of Pyrex Glass for Bio-MEMS Devices", Proc. of the 1st Int. Conf. on Bioengineering and Nanotechnology (ICBN), pp. 28, Singapore 26-29 Sept. 2004

 

  1. Hong Zhu, Jianmin MIAO, Zhihong WANG, Changlei Zhao and Weiguang ZHU, “Fabrication of ultrasonic arrays with 7mm PZT thick films as ultrasonic emitter for object detection in air”, Eurosensors XIII, Rome (Italy), September 13-15, 2004.

 

  1. Jianmin Miao, “Deep Silicon Micromachining Technology and Its Applications”, GlobalTRONICS Technology Conference, September 2004, Singapore.

 

  1. Z. H. Wang, W. ZHU, C. Chao, O. K. Tan, and J. M. Miao, “Piezoelectric MEMS Ultrasonic Transducer Arrays”, 4th Asian Meeting on Electroceramics, 27 – 30 June 2004, Hangzhou, China. Invited Paper.

 

  1. Ciprian Iliescu, T.T. Sun, Mihaela Carp, Jianmin Miao, “Characterization of p++ layer and its application on bulk and surface MEMS devices”, FSISE 2004, May 14-16, 2004, Guangzhou (China).

 

  1. T.T. Sun, Jianmin Miao and Ciprian Iliescu, “Silicon microtrench etching using a high density plasma source”, FSISE, May 14-16, 2004, Guangzhou (China).

 

  1. Bangtao Chen, Jianmin Miao, and Hong Zhu, “Bulk-Micromachined Electrostatic Microactuators for Hard Disk Drives”, DTIP of MEMS & MOEMS, Montreux (Switzerland), May 12-14, 2004.

 

  1. D. Sheeja, B. K. Tay, J. Miao, A. Takada, C. T. Cheng, C. B. Yeo, "Optimisation of DLC coating prepared on the side walls of Si trenches by a hybrid processing of FCVA and PI3", ICNDST-9, Japan, 2004.

 

  1. T.T. Sun, Jianmin Miao, R.M. Lin and W.J. Wang, “Study on features of silicon microtrench with inductively coupled plasma etcher”, SPIE’s Symposium on Smart Materials and MEMS, Perth (Australia), 10-12 December 2003.

 

  1. C. Iliescu, J. Miao, F.E.H. Tay, “Low cost wafer level packaging of MEMS devices”, EPTC (Electronic packaging technology Conference), December 2003, Singapore.

 

  1. Z.H. Zhou, H. Zhu, J.M. Miao, J.M. Xue and J. Wang, “Lead zirconate titanate thin films derived from multi-step sol-gel”, paper presented at EMF2003, 10th European Meeting on Ferroelectricity, 3-8 August 2003, Cambridge University, Cambridge, United Kingdom.

 

  1. Bangtao Chen, Jianmin Miao, Hong Zhu, “Analysis And Comparison Of Flexure Structures Used In 3-D Electrostatic Microactuators For Hard Disk Drives”. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Tietun Sun, Jianmin Miao, Hong Zhu, Ciprian Iliescu, J. B. Sun, “Study On Feature Of Silicon Microtrenches With A Multiplexed Inductively Coupled Plasma Etcher”. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Ciprian Iliescu, Jianmin Miao, Marioara Avram: Fabrication Of Chip Scale Piezoresistive Pressure Sensors Using Screen-Printed Glass Frit Packaging. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Jianbo Sun, Jianmin Miao, Tietun Sun, Hong Zhu: Development And Comparison Of Micromachined Inductors For RF Applications. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Hong Zhu, Jianmin Miao, Bantao Chen, Zhihong Wang, Weiguan Zhu, “Micromachining Process Of Piezoelectric Microcantilever Using Pzt Thin Film”, ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Liujiang Yu, B. K. Tay, D. Sheeja, Y. Q. Fu, Jianmin Miao: Fabrication Of Amorphous Carbon Micro-Membranes By Deep Reactive Ion Etching Technique. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. D. Sheeja, B. K. Tay, L. J. Yu, Jianmin Miao, Y. Q. Fu, D. H. C. Chua, W. I. Milne: Fabrication Of Smooth Diamond-Like Carbon Microcantilever Arrays. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. Ciprian Iliescu, Tietun Sun, Jianmin Miao, Francis Eng Hock Tay: Fabrication Process Of A Capacitive Microphone With p++ Diaphragm And Silicon Bonded Top-Plate. ICMAT 2003, 7-12 December 2003, Singapore.

 

  1. W.Z. Li, J.M. Xue, Z.H. Zhou and J. Wang, H. Zhu and J.M Miao, “0.67Pb(Mg1/3Nb2/3)O3-0.33PbTiO3 thin films derived from RF magnetron sputtering”, Paper presented at ICMAT2003 – International Conference on Materials for Advanced Technologies, 7-12 December 2003, Singapore.

 

  1. W.Z. Li, J.M. Xue, Z.H. Zhou, J.M. Xue, J. Wang, H. Zhu and J.M. Miao, “Design issues in multilayer piezoelectric biosensors”, Paper presented at ICMAT2003 – International Conference on Materials for Advanced Technologies, 7-12 December 2003, Singapore.

 

  1. Z. Wang, W. ZHU, C. Chao, H. Zhu and J. M. Miao, “MEMS Device Arrays Using Thick Composite PZT films”, 106 Am. Ceram. Soc. Meeting, 2003. Invited Paper.

 

  1. T.T. Sun, Jianmin Miao, R.M. Lin and W.J. Wang, “A novel method of texturing multi-crystalline silicon surface”, ICOPE 2003 (International Conference on Precision Engineering), 2-5 March 2003, Singapore.

 

  1. Jianmin Miao and Ciprian Iliescu, “A Reliable Fabrication Process for Capacitive Microphones with Sensitive Trimming”, Micro System technologies 2003, Munich (Germany), October 7-8, 2003. 

 

  1. Ciprian Iliescu and Jianmin Miao, “Chip scale packaging in glass of pressure sensors”, Micro System technologies 2003, Munich (Germany), October 7-8, 2003.

 

  1. Z.H. Zhou, J.M. Xue, S. Ezhilvalavan, W.S. Toh, J. Wang, Z.Zhu and J.M. Miao, “(Na05Bi0.5)TiO3 thin films prepared by RF magnetron sputtering”, Paper presented at 5th International Meeting of Pacific Rim Ceramic Societies, PacRim5, 29 September – 2 October 2003, Nagoya, Japan

 

  1. Bangtao Chen, Jianmin Miao, Hong Zhu, “Development of 3-D electrostatic Microactuator for hard Disk Drives”, JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment (IIP/ISPS Joint MIPE), June 15-18, 2003, Yokohama (Japan).

 

  1. Hong Zhu, Jiamin Miao, Bangtao Chen, Zhihong Wang and Weiguang Zhu, “Membrane Microcantilever Arrays Fabrication with PZT Thin Films for nanorange Movement”, JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment (IIP/ISPS Joint MIPE), June 15-18, 2003, Yokohama (Japan).

 

  1. Jianmin Miao, Hans L. Hartnagel, “High-energy ion implantation: An alternative technology for micromachining three-dimensional GaAs structures”, TRANSDUCERS, 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Boston (USA), Vol, June 9-12, 2003, pp. 1071-1074.

 

  1. Lei Xu, Xiaoyuan Peng, Anand Asundi, and Jianmin Miao, “Interferometric characterization of micromachined silicon structures with digital holography”, International Symposium on Experimental Mechanics (ISEM), Taiwan, 28-30 December 2002.

 

  1. Hong Zhu, Jianmin Miao, Minoru Noda, Masanori Okuyama, “Preparation of BST ferroelectric thin film by metal organic decomposition for infrared sensor”, EuroSensors XVI, Prague (Czech), 15-18 September 2002.

 

  1. Ciprian Iliescu and Jianmin Miao, "Fabrication of chip-scale piezoresitive pressure sensors using screen-printed glass-frit packaging", Eurosensors XVI, 2002, Praque (Czech), 15-18 September 2002.

 

  1. Hong Zhu, Min Zhou, Bangtao Chen and Jianmin Miao, “Fabrication of microcantilever arrays using sol-gel PZT thin film for nanopositioning”, Asia-Pacific Magnetic Recording Conference, 28-29 Aug. 2002, Singapore.

 

  1. Bangtao Chen, Hong Zhu and Jianmin Miao, “A New Design of Electrostatic Microactuator for Hard Disk Drives”, Asia-Pacific Magnetic Recording Conference, 28-29 Aug. 2002, Singapore.

 

  1. Lei Xu, Xiaoyuan Peng, Jianmin Miao, Anand Asundi, “Development and validation of digital micro-holo interferometric system for micro mechanical testing”, SPIE, Vol. 4778, June 2002.

 

  1. Ciprian Iliescu and Jianmin Miao, "Wafer level packaging solution for pressure sensors", DTIP Conference, Cannes (France), 6-8 May 2002.

 

  1. Lei Xu, Xiaoyuan Peng, Jianmin Miao, Anand Asundi, “Discretization effects on imaging performance of digital holographic systems”, Proceedings of SPIE, Vol. 4823, 2002.

 

  1. Lei Xu, Xiaoyuan Peng, Jianmin Miao, Anand Asundi, “High-resolution micromeasurement with digital holography in optical fabrication and testing”, Proceedings of Optical Society of America, 2002.

 

63.  Ciprian Iliescu and Jianmin Miao, "Flip-chip solutions for pressure sensor packaging", APACK 2001, Singapore, 5-7 December 2001.

 

64.  Ciprian Iliescu and Jianmin Miao, "Aluminium-silicon and gold-silicon eutectics: new opportunities for MEMS technologies" MRS Conference - Boston (USA), 26-29 November 2001.

 

  1. Jianmin Miao, et al, “MEMS Devices Micromachined by Using Deep Reactive Ion Etching”, The Sixth International Conference on Solid-State and Integrated-Circuit Technology, October 22-25, 2001, Shanghai, China.

 

  1. Jianmin Miao, Hans L. Hartnagel, Bernard L. Weiss, “Complex MEMS structures processed by deep nitrogen implantation”, International Conference on Materials for Advanced Technologies (ICMAT 2001), 1- 6 July 2001, Singapore.

 

  1. Guangyu Wang and Jianmin Miao, Tietun Sun, Lihui Guo“Development of Mmicromachined RF silicon inductors”, Proceedings of the International MEMS Workshop 2001, pp.311-315, 4-6 July 2001, Singapore.

 

  1. Hong Zhu, Jianmin Miao, Minoru Noda, Huaping Xu, Takao Nakamura, and Masanori Okuyama, “Uncooled infrared image sensor of dielectric bolometer mode using ferroelectric BST thin film prepared by MOD”, Proceedings of the International MEMS Workshop 2001, pp.377-382, 4-6 July 2001, Singapore.

 

  1. Sun Tietun and Miao Jianmin, “New design for thermopile infrared detector”, Proceedings of the International MEMS Workshop 2001, pp.299-302, 4-6 July 2001, Singapore.

 

  1. W. M. Huang, J. P. Tang, Q. Y. Liu, X. Y. Gao, J. H. Yeo, J. M. Miao, L. M. He, and B. K. A. Ngoi, “Si-NiTi Shape Memory Alloy Tweezers”, Proceedings of the International MEMS Workshop 2001, pp.603-611, 4-6 July 2001, Singapore.

 

  1. Tan, J. P., Gao, X., Huang, W., Yeo, J. H. and Miao, J. M., “NiTi Shape Memory Alloy Thin Film Based Micro Gripper”, SPIE Vol.4234, 2001, pp 106-112.

 

  1. L. Chen, L. Guo, J. Miao, R. Lin, “Control of stresses in highly doped multi-layer polysilicon structures used in MEMS applications”, SPIE’s Symposium on Smart Materials and MEMS, 13-15 December 2000, Melbourne, Australia.

 

  1. Y. Q. Fu, H. J. Du, W.M. Huang, X. Huang, J. M. Miao, “Preparation of crystalline TiNi shape-memory alloy thin film for MEMS applications”, SPIE's Microelectronics and Assembly Symposium, Singapore, 27 November - 1 December 2000, pp. 140-146.

 

  1. Y. Q. Fu, H.J. Du, J. M. Miao, Y.J. Liu, “Patterning of diamond microstructures on Si substrate by bulk and surface micromachining”. SPIE's Microelectronics and Assembly Symposium, Singapore, 27 November - 1 December 2000, pp. 164-169.

 

  1. Jianmin Miao, et al, “Design consideration in micromachined silicon microphones”, SPIE’s International Symposium on Microelectronics and Assembly, 27 November - 1 December 2000, Singapore.

 

  1. X. Li, R. Lin, H. Kek, J. Miao, “Sensitivity-enhanced silicon condenser microphone with a novel single deeply corrugated diaphragm”, SPIE’s 2000 Symposium and Education Program on Micromachining and Microfabrication, 18 - 20 September 2000, Santa Clara, USA.

 

  1. L. Chen, J. Miao, “Influence of pre-annealing on residual stresses induced by boron-doping in LPCVD polysilicon film”, SPIE’s 2000 Symposium and Education Program on Microelectronic Manufacturing, 18-19 September 2000, Santa Clara, USA.

 

  1. X. Li, R. Lin, J. Miao, “A novel silicon condenser microphone with single deeply corrugated diaphragm for improved sensitivity “, Eurosensors XIV, The 14th European Conference on Solid-State Transducers, 27-30 August 2000, Copenhagen, Denmark

 

  1. B. Zhao, A. Asundi, J. Miao, “Diffraction strain sensor for micromeasurements”, SPIE’s Annual Meeting and Exhibition, The International Symposium on Optical Science and Technology, 30 July - 4 August 2000, San Diego, USA.

 

  1. L. Xu, J. Miao, A. Asundi, “Digital micro-holo-interferometry for micro-scale component studies”, SPIE’s Annual Meeting and Exhibition, The International Symposium on Optical Science and Technology, 30 July - 4 August 2000, San Diego, USA

 

  1. Tan, J. P., Gao, X., Huang, W., Yeo, J. H. and Miao, J. M., “NiTi Shape Memory Alloy Thin Film Based Microgripper”, SIBA2000, 28 June – 1 July 2000, Montréal, Canada, pp14-17.

 

  1. Zhang Jian, Gong Haiqing, Wang Xiaodong, Hong Guodong, and Miao Jianmin, “Wafer-to-wafer bonding technologies for microstructures and microelectromechanical systems (MEMS)”, APACK ’99, Symposium on Advanced in Packaging, 8-10 December 1999, Singapore.

 

  1. A.Q. Liu, Franck Chollet, A. Asundi, and Jianmin Miao, “Microelectromechanical fiber optical switches”, ISPA ’99, International Symposium on Photonics and Applcations, 29 November-3 December 1999, SPIE Vol. 3897, pp.380-387, Singapore.

 

  1. K. Lal, N. Goswami, J. Miao, H. L. Hartnagel, “High Resolution X–ray Diffraction Study of Free Standing Gallium Arsenide Coiled Membrane Force Sensors Produced by Micromachining”, Indo-Russian Workshop on Micromechanical Systems, SPIE, Volume 3903, pp. 77-83, November, 1999, USA.

 

  1. X. Li, R. Lin, J. Miao, M. Bao, “Novel mechanical sensor array structures with multi-thickness configuration formed by masked/maskless two-stage anisotropic etching technology”, SPIE’s 1999 Symposium and Education Program on Micromachining and Microfabrication, 20-22 September 1999, Santa Clara, USA.

 

  1. X. Li, R. Lin, J. Miao, M. Bao, “Which etchant used und whether an etching mask exists: how they make differences on convex-corner undercutting configuration and compensation criteria”, SPIE’s 1999 Symposium and Education Program on Micromachining and Microfabrication, 20-22 September 1999, Santa Clara, California USA, Proc. SPIE Vol. 3874, pp. 129-136, Micromachining and Microfabrication Process Technology V, 08/1999.

 

  1. Quanbo Zou, Rongming Lin, Jianmin Miao, “Silicon capacitive microphones with corrugated diaphragms”, Proceedings of 137th meeting of the Acoustical Society of America and the 2nd convention of European Acoustics Association, Berlin (Germany), 14-19 March, 1999

 

  1. J Miao, B L Weiss, H L Hartnagel R J Wilson and D Ruck, "The fabrication of complex membrane structures in n-GaAs for micromechanical applications", Mat. Res. Soc. Symp. Proc. 396, 853-858, USA. 1996.

 

  1. K. Mutamba, A. Vogt, A. Sigurdardottir, J. Miao, A. Dehe, I. Aller, and H.L. Hartnagel, “Uniaxial stress dependence of AlGaAs/GaAs RTD characteristics for sensor applications”, Proc. 7th Micromechanics Europe MME'96, p. 85, Barcelona (Spain), October 21-22, 1996.

 

  1. I.M. Tiginyanu, J. Miao, I.M. Tiginyanu, H.L. Hartnagel, D. Rueck, K. Tinschert, V.V. Ursaki, V.M. Ichizli, “Raman and electrical characterization of n-InP implanted by 630-keV nitrogen,” Proc. Eighth International Conference on Indium Phosphide and Related Materials, 21-25 April 1996, Schwaebisch Gmuend (Germany).

 

  1. J. Miao, H.L. Hartnagel, B.L. Weiss and R.J. Wilson, “Fabrication of free-standing membranes in GaAs using MeV nitrogen implantation for sensors”, Proc. Fall Meeting of Materials Research Society (MRS), Boston, MA(USA), 27 November-1 December 1995.

 

  1. J. Miao, K. Hjort, H.L. Hartnagel, J.A. Schweitz, D. Rueck and K. Tinschert, “Resonant sensors on thin semi-insulating GaAs membranes”, Proc. Transducers’95-Eurosensors IX, Stockholm (Swede), 25-29 June 1995, pp. 604-607.

 

  1. D. Dumka, R. Riemenschneider, J. Miao, H.L. Hartnagel and B.R. Singh, “High barrier Schottky contacts on n-InP using damage free electrochemical metallization”, WOCSDICE’95 (19’th Workshop on Compound Semiconductor Devices and Integrated Circuits), Stockholm (Swede), 21-24 March 1995.

 

  1. J. Miao, D. Rueck, K. Tinschert and H.L. Hartnagel, “Fabrication of micromechanical structures on GaAs using ion implantation for sensor applications”, Seminar on Industry and Research, German research center for heavy ions, Darmstadt (Germany), 22 March 1995.

 

  1. V. Krozer, M. Ruppert, J. Miao, W.Y. Lee, M. Schuessler, K. Fricke and H.L. Hartnagel, “Modelling of high temperature performance of MESFET’s and HBT’s”, Proc. 2nd Int. High temperature Electronics Conf. (HiTEC), Charlotte(USA), 5-10 June 1994, pp. IV9-14.

 

  1. J. Miao, H.L. Hartnagel, D. Rueck, K. Fricke, J. Wuerfl, A. Grueb, “Microstructuring of ion-implanted GaAs for high temperature sensor applications, Proc. European Gallium Arsenide and Related III-V Compounds Applications Symposium, Torin (Italy), 28-30 April 1994, pp. 89-92.

 

  1. Jianmin Miao, Hans L. Hartnagel, Joachim Wuerfl and Dorothee Rueck, “Investigation of defects induced during the fabrication of integrated sensors on GaAs using ion implantation”, Proc. 5th Int. conf. On defect Recognition and Image Processing in Semiconductors and Devices, Institute of Physics Conference Series Number 135, Santander (Spain), 6-10 September 1993, pp. 365-368.

 

  1. J. Miao, J. Wuerfl, K. Fricke, D. Rueck and H.L. Hartnagel, “Fabrication of sensor microstructures in GaAs by ion implantation”, Workshop Digest of MicroMechanics Europe 1993 (MME’93), Neuchatel (Switzerland), 7-8 September, 1993, pp. 55-58.