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Journal Publications

Year 2008

 

1.      Feixiang Ke, Jianmin Miao and Joachim Oberhammer, “A ruthenium-based multi-metal contact RF MEMS switch with a corrugated diaphragm”, Journal of Microelectromechanical Systems, accepted, 2008.

 

2.      Pradeep Dixit, Yaofeng Sun,  Jianmin Miao, John H. L. Pang, Ritwik Chatterjee and Rao R. Tummala, “Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias”, Journal of The Electrochemical Society, 155(12),  H981-H986, 2008.

 

3.      Ting Xu, Zhihong Wang, Jianmin Miao, Ling Yu, Changming Li, “Micro-machined piezoelectric membrane based immunosensor array”, Biosensors and Bioelectronics, 24 (2008) 638–643.

 

4.      EHT Teo, DHC Chua, LTW Lim, S O'Shea, JM Miao, BK Tay, “Fabrication and characterization of multilayer amorphous carbon films for microcantilever devices”, IEEE Sensors Journal,  Vol. 8, No.5-6, pp. 616-620, May-June 2008.  

 

5.      Jie Wu, Shao Wang and Jianmin Miao, “A MEMS device for studying the friction behavior of micromachined sidewall surfaces”, Journal of Microelectromechanical Systems, Vol.7, No.4, pp.921-933, August 2008.

 

6.      Pradeep Dixit, Xiaofeng Chen, Jianmin Miao, and Robert Preisser, “Effect of improved wettability of silicon based materials with electrolyte for void free copper deposition in high aspect ratio through-vias”, Thin Solid Films, Vol. 516, No. 16, pp. 5194-5200, June 2008.

 

7.      Tong Yunxiang, Liu Yong, Jianmin Miao, “Phase transformation in NiTiHf shape memory alloy thin films”, Thin Solid Films, Vol. 516, No. 16, pp. 5393-5396, June 2008.

 

8.      Zhiqiang Luo, Sanhua Lim, Yumeng You, Jianmin Miao, Hao Gong, Jixuan Zhang, Shanzhong Wang, Jianyi Lin and Zexiang Shen,Effect of ion bombardment in the synthesis of vertically aligned single-walled carbon nanotubes by plasma-enhanced CVD”, Nanotechnology, Vol. 19, No.25 Article Number: 255607,  June 2008.

 

9.      Ciprian Iliescu, Bangtao Chen, Jianmin Miao, “On the wet etching of Pyrex glass”, Sensors & Actuators A: Physical, 143 (2008) 154–161.

 

10.  Zhihong Wang, Jianmin Miao, Weiguang Zhu, “Micromachined ultrasonic transducers and arrays based on piezoelectric thick film”, Applied Physic A Materials Science & Processing, 91(1), pp.107-117, April 2008.

 

11.  Qian HX, Zhou W, Miao J, et al., “Fabrication of Si microstructures using focused ion beam implantation and reactive ion etching”, J. Micromech. Microeng, 18(3), March 2008, Article Number: 035003.

 

12.  Zhihong Wang, Jianmin Miao, Chee Wee Tan, Ting Xu, “Fabrication of piezoelectric MEMS devices-from thin film to bulk PZT wafer”, J. Electroceram, DOI 10.1007/s10832-008-9454-x, Feb 2008.

 

13.  Dixit P, Lin N, Miao JM, Wai Kwan Wong and Teo Kiat Choon., “Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging”, Sensors & Actuators A: Physical, 141(2), pp. 685-694, Feb 15 2008.

 

14.  ZH Wang and JM Miao, “Critical electrode size in measurement of d33 coefficient of films via spatial distribution of piezoelectric displacement”, Journal of Physics D - Applied Physics, 41(3), Article Number: 035306, Feb 7 2008.

 

15.  Pradeep Dixit and Jianmin Miao, “High aspect ratio vertical through-vias for 3-D MEMS packaging applications by an optimized three-step deep reactive ion etching technique”, Journal of the Electrochemical Society, 1559(2), pp. H85-H91, 2008.

 

Year 2007

 

16.  Zhanwei Liu, Huimin Xie, Daining Fang, Changzhi Gu, Yonggang Meng, Weining Wang, Yan Fang and Jianmin Miao, “Deformation analysis in microstructures and micro-devices”, Microelectronics Reliability, 47(12), pp.2226-2230, Dec. 2007.

 

17.  Vijay Raj Singh, Jianmin Miao, Zhihong Wang, Gopalkrishna Hegde, Anand Asundi, “Dynamic characterization of MEMS diaphragm using time averaged in-line digital holography”, Optics Communications, 280(2), pp. 285-290, Dec. 2007.

 

18.  Chee Wee Tan, Zhihong Wang, Jianmin Miao, Xiaofeng Chen, “A study on viscous damping effect for diaphragm-based acoustic MEMS applications”, J. Micromech. Microeng., 17(11), pp. 2253-2263, Nov. 2007.

 

19.  Pradeep Dixit, Luhua Xu, Jianmin Miao, John H. L. Pang and Robert Preisser, “Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects”, J. Micromech. Microeng. 17, No. 9, pp. 1749-1757, 2007.

 

20.  Ting Xu, Zhihong Wang, Jianmin Miao, Xiaofeng Chen and C. M. Tan, “Aligned carbon nanotubes for through-wafer interconnects,” Applied Physics Letters 91, No. 4, Art. No. 042108, July 2007.

 

21.  Pradeep Dixit, Xiaofeng Chen, Jianmin Miao, Sheeja Divakaran and Robert Preisser, “Study of surface treatment processes for improvement in the wettability of silicon based materials used in high aspect ratio through-via copper electroplating”, Applied Surface Science, 253, No. 21, 8637-8646, August 2007.

 

22.  Pradeep Dixit, Chee Wee Tan, Luhua Xu, Nay Lin, Jianmin Miao, John H. L. Pang, Petra Backus and Robert Preisser, “Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating,” J. Micromech. Microeng. 17, No. 5, 1078-1086, 2007.

 

23.  Bangtao Chen and Jianmin Miao, “Influence of deep RIE tolerances on comb-drive actuators performance”, Journal of Physics D: Applied Physics 40(4), 970-976, February 2007.

 

24.  H. X. Qian, W. Zhou, X. M. Li, Jianmin Miao, et al, “Accurate detection of interface between SiO2 film and Si substrate”, Applied Surface Science 253, No. 12, 5511-5515, April, 2007.

 

25.  Ciprian Iliescu, Francis E. H. Tay and Jianmin Miao, “Strategies in deep wet etching of Pyrex glass”, Sensors & Actuators A: Physical, 133, 395-400, 2007.

 

26.  Luhua Xu, Pradeep Dixit, Jianmin Miao, John H. L. Pang, Xi Zhang, K. N. Tu and Robert Preisser, “Through-wafer electroplated copper interconnect with ultra-fine grains and high density of nano-twins”, Applied Physics Letters 90, No. 3, Art. No. 033111, 2007.

 

27.  N. Goswami, K. Lal, Jianmin Miao and H. L. Hartnagel, “Microfabrication and characterization of gallium arsenide membranes for force sensor applications”, Indian Journal of Pure & Applied Physics 45, No. 4, 382-386, 2007.

 

28.  Zhihong Wang, Jianmin Miao and Weiguang Zhu, “Piezoelectric thick films and their application in MEMS”, Journal of the European Ceramic Society 27, No. 13, 3759-3764, January 2007.

 

29.  Bangtao Chen, Jianmin Miao and Francis E. H. Tay, “Fabrication and characterization of DRIE-micromachined electrostatic microactuators for hard disk drives”, Microsystem Technologies, 13 (1), pp. 11-19, January 2007.

 

Year 2006

 

30.  Ciprian Iliescu, Bangtao Chen, Jianmin Miao, Marioara Avram and Andrei Marius Avram, “Inertial sensors with tunable range”, Romanian Journal of Information Science and Technology 9, No. 4, 311-320 (2006).

 

31.  Pradeep Dixit, Jianmin Miao and R. Preisser, “Fabrication of high aspect ratio 35 µm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking”, Electrochemical and Solid-State Letters 9, No. 10, pp. G305-G308, Sept. 2006.

 

32.  Chee Wee Tan and Jianmin Miao, “Analytical modeling of bulk-micromachined condenser microphones”, Journal of the Acoustical Society of America 120, No. 2, 750-761, August, 2006.

 

33.  H. Dong, C. M. Li, Q. Zhou, J. B. Sun and J. M. Miao, “Sensitive electrochemical enzyme immunoassay microdevice based on architecture of dual ring electrodes with a sensing cavity chamber”, Biosensors and Bioelectronics, 22 (5), pp. 621-626, December, 2006.

 

34.  Pradeep Dixit and Jianmin Miao, “Effect of clamping ring materials and chuck temperature on the silicon nano-grass formation in deep reactive ion etching process”, Journal of the Electrochemical Society, 153 (8), G771-G777, August, 2006.

 

35.  Pradeep Dixit and Jianmin Miao, “Aspect ratio dependent copper electrodeposition technique for very high aspect ratio through-hole plating”, Journal of the Electrochemical Society, 153 (6), G552-G559, June, 2006.

 

36.  Ji Jing, Francis Tay E. H. and Jianmin Miao, “Microfabricated microneedle with porous tip for drug delivery”, Journal of Micromechanics and Microengineering, 16(5), May 2006, 958–964.

 

37.  Francis E.H. Tay, Ciprian Iliescu, Ji Jing and Jianmin Miao, “Defect-free wet etching through Pyrex glass using Cr/Au mask”, Microsystem Technologies,Vol 12, No.10-11,  September 2006, 935-939.

 

38.  Zhihong Wang, Weiguang Zhu, Jianmin Miao, Hong Zhu, Chen Chao, and Ooi Kiang Tan, “Micromachined thick film piezoelectric ultrasonic transducer array”, Sensors & Actuators A: Physical, Vol. 130-131, 14 August 2006, 485-490.

 

39.  Zhihong Wang, Weiguang Zhu, Jianmin Miao, Chen Chao, and Ooi Kiang Tan, “Measurement of longitudinal piezoelectric coefficient of film with scanning-modulated interferometer“, Sensors & Actuators A: Physical 128, No. 2, 327–332, April, 2006.

 

40.  Jianxia Gao, L. P. Yeo, Mary B. Chan-Park, Jianmin Miao, Yehai Yan, Jianbo Sun, Y. C. Lam and C. Y. Yue, “Anti-stick post-passivation of high aspect ratio silicon molds fabricated by deep reactive ion etching”, Journal of Microelectromechanical Systems 15, pp. 84-93, 2006.

 

Year 2005

 

41.  Kwong-Luck Tan, Ciprian Iliescu, Francis Tay, Hui-Tong Chua and Jianmin Miao, “Nanotips cold-end contact for microcooling systems”, International Journal of Nanoscience, Vol. 4, No. 4 (2005) 701-707.

 

42.  Bangtao Chen, Jianmin Miao, Chun Kiat Lim, Francis E. H. Tay and Ciprian Iliescu, “Dynamic behaviour of high-G MEMS accelerometer incorporated with novel micro-flexures”, International Journal of Software Engineering and Knowledge Engineering, Vol. 15, No.2 (2005), pp.225-230.

 

43.  Jianmin Miao, Jianbo Sun and Michel Puech, “Fabrication of thick SiO2 block with a dry-released underneath cavity in silicon for RF MEMS”, Electronics Letters, 26th May 2005, Vol. 41, No. 11, pp. 662-663.

 

44.  Kaixue Ma, Jian-Guo Ma, Jianbo Sun, Jianmin Miao, Manh Anh Do and Kiat Seng Yeo, “A miniaturized silicon-based ground ring guarded patch resonator and filter”, IEEE Microwave and Wireless Components Letters, July 2005, Vol. 15, No. 7, pp. 478-480.

 

45.  Jianbo Sun and Jianmin Miao, “High performance MEMS inductors fabricated on the localised and planar thick SiO2 layer”, Electronics Letters, 31 March 2005, Vol. 41, No. 7, pp. 446-447.

 

46.  Hong Zhu, Jianmin Miao, Zhihong Wang, Changlei Zhao and Weiguang Zhu, “Fabrication of ultrasonic arrays with 7 mm PZT thick films as ultrasonic emitter for object detection in air”, Sensors and Actuators A: Physical, Vol. 123-124, 23 September 2005, pp. 614-619.

 

47.  Lei Xu, Xiaoyuan Peng, Zhixiong Guo, Jianmin Miao and Anand Asundi, “Imaging analysis of digital holography”, Optics Express 13, 2444-2452, April 2005.

 

48.  Zhihong Wang, Weiguang Zhu, Hong Zhu, Jianmin Miao, Ooi Kiang Tan and Changlei Zhao, “Fabrication and characterization of piezoelectric micromachined ultrasonic transducers with thick composite PZT films”, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 52(12), December 2005, pp.2289-2297.

 

49.  C. Iliescu, J. Ji, F. E. H. Tay, J. M. Miao and T. T. Sun, "Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution", Surface and Coatings Technology, Vol.198 (1-3), 1 August 2005, pp. 314-318.

 

50.  C. Iliescu, M. Carp, J. M. Miao, F. E. H. Tay and D. P. Poenar, "Analyze of high boron doping from spin on diffusing source", Surface and Coatings Technology, Vol.198 (1-3), 1 August 2005, pp. 309-313.

 

51.  Hong Zhu, Jianmin Miao, Bangtao Chen, Zhihong Wang and Weiguang Zhu, “Membrane microcantilever arrays fabrication with PZT thin films for nanorange movement”, Microsystem Technologies, Vol. 11, No. 8-10, August 2005, pp.1121-1126.

 

52.  Jun Zhang, Mary B. Chan-Park, Jianmin Miao and Tietun Sun, “Reduction of diffraction effect for fabrication of very high aspect ratio microchannels in SU-8 over large area by soft cushion technology”, Microsystem Technologies, Vol. 11(7), July 2005, pp. 519-525.

 

53.  Yunxiang Tong, Yong Liu, Jianmin Miao and Liancheng Zhao, “Characterization of a nanocrystalline NiTiHf high temperature shape memory alloy thin film”, Scripta Materialia, 52 (2005), 983–987.

 

54.  Z. H. Wang, W. G. Zhu O. K. Tan, C. Chao, Hong Zhu and  Jianmin Miao, “Ultrasound radiating performances of piezoelectric micromachined ultrasonic transmitter”, Applied Physics Letters, 86 (3): Art. No. 033508, January 17 2005.

 

55.  Ciprian Iliescu, Jianmin Miao and Francis E. H. Tay, “Optimization of PECVD amorphous silicon process for deep wet etching of Pyrex glass”, Surface and Coatings Technology, 192 (1): 43-47 March 1 2005.

 

56.  Z. H. Zhou, J. M. Xue, W. Z. Li, J. Wang, H. Zhu and J. M. Miao, “Leakage current and charge carriers in (Na0.5Bi0.5)TiO3 thin film”, J. Phys. D: Appl. Phys. 38, No. 4, 642-648, (2005).

 

57.  Tietun Sun, Jianmin Miao, Rongming Lin and Yongqing Fu, “The effect of baking conditions on the effective contact areas of screen-printed silver layer on silicon substrate”, Solar Energy Materials and Solar Cells, 85 (1), pp. 73-83, January 2005.

 

58.  Ciprian Iliescu, Jianmin Miao and Francis E. H. Tay, “Stress control in masking layers for deep wet micromachining of Pyrex glass”, Sensors and Actuators A: Physical, Volume 117, Issue 2, 14 January 2005, pages 286-292.

 

59.  T. T. Sun, Z. G. Liu, B. C. Yu, M. B. Chen and Jianmin Miao, “Silicon micro-trench etching using high-density plasma etcher”, Acta Metallurgica Sinica (English Letters) 18, No. 3, pp. 397-402 (2005).

 

Year 2004

 

60.  Daniel H. C. Chua, B. K. Tay, P. Zhang, E. H. T. Teo, L. T. W. Lim, S. O’Shea, J. Miao, W. I. Milne, “Vibratory response of diamond-like amorphous carbon 3 cantilevers under different temperatures”, Diamond and Related Materials, Volume 13, Issues 11-12, November-December 2004, pages 1980-1983.

 

61.  Z. H. Zhou, J. M. Xue, W. Z. Li, J. Wang, H. Zhu and J. M. Miao, “Ferroelectric and electrical behaviors of (Na0.5Bi0.5)TiO3 thin films”, Applied Physics Letters 85(5), August 2004, 804-806.

 

62.  Z. H. Zhou, J. M. Xue, W. Z. Li, J. Wang, H. Zhu and J. M. Miao, “Heterolayered lead zirconate titanate thin films of giant polarization”, Journal of Applied Physics 96 (2004) 5706-5711.

 

63.  W. Z. Li, J. M. Xue, Z. H. Zhou, J. Wang, H. Zhu and J. M. Miao, “0.67Pb(Mg1/3Nb2/3)O3-0.33PbTiO3 thin films derived from RF Magnetron sputtering’, Ceramics International, 30 [7] (2004) 1539-1542.

 

64.  Jun M. Xue, M. H. Sim, S. Ezhilvavan, Z. H. Zhou, J. Wang, H. Zhu, and J. M. Miao, “Ferroelectric and dielectric properties of 0.6SrBi(2)Nb(2)O(9)-0.4BiFeO(3) thin film”, Thin Solid Films, 460 (2004) 1-6.

 

65.  Jianmin Miao and Hans L. Hartnagel, “High-energy ion implantation: an alternative technology for micromachining three-dimensional GaAs structures”, Sensors & Actuators: A. Physical, 114, September 2004, pages 505-509.

66.  D. Sheeja, B. K. Tay, S. P. Lau, L. J. Yu, J. M. Miao, H. C. Chua and W. I. Milne, “Fabrication of smooth amorphous carbon micro-cantilevers by lift-off”, Sensors and Actuators: B Chemical, 98 (2-3): 275-281 March 15, 2004.

 

67.  Liujiang Yu, B. K. Tay, D. Sheeja, Y. Q. Fu and J. M. Miao, "Micromachining of large area amorphous carbon membranes prepared by filtered cathodic vacuum arc technique", Applied Surface Science, 286-293, 2004.

 

68.  Hong Zhu, Jianmin Miao, M. Noda and M. Okuyama, “Preparation of BST ferroelectric thin film by metal organic decomposition for infrared sensor”, Sensors & Actuators: A. Physical, 110 (1-3): 371-377, February, 2004.

 

Year 2003

 

69.  D. Sheeja, B. K. Tay, L. J. Yu, D. H. C. Chua, W. I. Milne, J. M. Miao and Y. Q. Fu, “Fabrication of amorphous carbon cantilever structures by isotropic and anisotropic wet etching methods”, Diamond And Related Materials, 12 (9): 1495-1499, September 2003.

 

70.  Lei Xu, Xiaoyuan Peng, Anand Asundi and Jianmin Miao, Digital micro-holo interferometer: development and validation”, Optical Engineering, Vol. 42, Issue 8, pp. 2218-2224, August 2003.

 

71.  Ciprian Iliescu and Jianmin Miao, “One-mask process for silicon accelerometers on Pyrex glass utilising notching effect in inductively coupled plasma DRIE”, Electronics Letters, Vol. 39, No. 8, 17 April 2003, pp. 658-659.

 

72.  Jianmin Miao, B. L. Weiss and H. L. Hartnagel, “Micromachining of three-dimensional GaAs membrane structures using high-energy nitrogen implantation”, J. Micromech. Microeng. Vol .13, No.1, January 2003, pp. 35-39.

 

73.  Y. Q. Fu, H. J. Du and J. M. Miao, “Preparation and patterning of diamond microstructures by bulk and surface micromachining”, Journal of Materials Processing Technology, Volume 132, Issues 1-3, 10 January 2003, pages 73-81.

 

Year 2002

 

74.  Jianmin Miao, H. L Hartnagel and B. L. Weiss, “Deep nitrogen implantation for GaAs microstructuring using pulsed electrochemical etching”, Journal of Applied Physics, Vol. 92, No. 5, September 2002, pp. 2923-2928, USA.

 

75.  L. J. Yu, D. Sheeja, B. K. Tay, Daniel H. C. Chua, W. I. Milne, J. Miao and Y. Q. Fu, “Etching behaviour of pure and metal containing amorphous carbon films prepared using filtered cathodic vacuum arc technique”, Applied Surface Science, Vol. 195, Issues 1-4, July 2002, pp.107-116.

 

76.  Jianmin Miao, R. Lin, L. Chen, Q. Zou, S. Y. Lim and S. H. Seah, “Design considerations in micromachined silicon microphones”, Microelectronics Journal, Vol. 33, Issue 1-2, pp. 21-28, January 2002, UK.

 

Year 2001

 

77.  Lei Xu, Xiaoyuan Peng, Jianmin Miao and Anand Asundi, “Hybrid holographic microscope for interferometric measurement of microstructures”, Optical Engineering, Vol. 40, Issue 11, pp. 2533-2539, November 2001.

 

78.  Bing Zhao, Jianmin Miao, Huimin Xie and Anaud Asundi, “Modeling of grating/moiré based micro motion sensor”, Microsystem Technologies, Vol. 7 (3), October 2001, pp.107-116.

 

79.  Lei Xu, Xiaoyuan Peng, Jianmin Miao and Anand Asundi, “Studies of digital microscopic holography with applications to microstructure testing”, Applied Optics, Vol. 40, No. 28, pp. 5046-5051, 1 October 2001.

 

80.  Bing Zhao, Ai-Qun Liu, Franck Chollet, Jianmin Miao, Huimin Xie and Anaud Asundi, “Designing and modelling of a grating-based displacement micro-transducer”, Nanotechnology, Vol. 12, pp. 308-315, August 2001.

 

81.  Xinxin. Li, Rongming Lin, Huatsoon Kek, Jianmin Miao and Quanbo Zou, “Sensitivity-improved silicon condenser microphone with a novel single deeply corrugated diaphragm“, Sensors & Actuators: A. Physical, 92(1), pp. 257-262. August 2001.

 

82.  Longqing Chen, Jianmin Miao, Lihui Guo and Rongming Lin, “Control of stress in highly doped polysilicon multi-layer diaphragm structure”, Surface and Coatings Technology, Volume 141, Issue 1, June 2001, pp. 96-102.

 

83.  L. Fu, J. M. Miao, X. X. Li and R. M. Lin, “Study of deep silicon etching for micro-gyroscope fabrication”, Applied Surface Science, 177 (1-2), June 1, 2001, pp. 78-84.

 

84.  Lei Xu, Jianmin Miao and Anand Asundi, “In-line digital micro-holo-interferometry”, Asian Journal of Physics, Volume 10, No. 1, Jan-March, 2001, pp.105-112.

 

Year 2000

 

85.  Lei Xu, Jianmin Miao and Anand Asundi, “Properties of Digital Holography Based on In-line Configuration”, Optical Engineering, Volume 39, Issue 12, December 2000, pp.3214-3219.

 

86.  Xinxin Li, Rongming Lin, Jianmin Miao and Minhang Bao, “Study on convex-corner undercutting formed by masked–maskless etching in aqueous KOH”, Journal of Micromechanics and Microengineering. Vol .10, September 2000, 309–313.

 

Year 1992-1999

 

87.  K. Lal, N. Goswami, J. Miao and H. L. Hartnagel, “Structural characterization of free-standing gallium arsenide coiled membranes produced by micro-machining”, Journal of Applied Crystallography, Vol. 32, February 1999, pp. 60-64.

 

88.  J. Miao, I. M. Tiginyanu, H. L. Hartnagel, G. Imer, J. Monecke and B. L. Weiss, “The characteristics of high-resistance layers produced in n-GaAs using MeV-nitrogen impantation for three-dimension structuring”, Applied Physical Letters, 70(7), 17 February 1997, pp. 847-849.

 

89.  D. C. Dumka, R. Riemenscheider, J. Miao, H. L. Hartnagel and B. R. Singh, “Electrochemical Fabrication High-Barrier Schottky Contacts on n-InP and their Application for Metal-Semiconductor-Metal Photodectors”, J. Electrochem. Soc., Vol 143, No. 6, June 1996, pp.1945-1948.

 

90.  J. Miao, H. L. Hartnagel, B. L. Weiss and R. J. Wilson, “Improved free standing membranes in GaAs for sensor applications”, Electronics Letters, Vol. 31, No. 13, 22 June 1995, pp. 1047-1049.

 

91.  J. Miao, H. L. Hartnagel, D. Rueck and K. Fricke, “The use of ion implantation for micromachining of GaAs for sensor applications”, Sensors & Actuators: A. Physical, Vol. 46, No.1, January 1995, pp. 30-34.

 

92.  K. Fricke, J. Wuerfl, J. Miao, A. Dehe, D. Rueck and H. L. Hartnagel, “Fabrication of microstructures for integrated sensors on GaAs”, Journal of Micromechanics and Microengineering, Vol. 3, September 1993, pp. 131-134.

 

93.  Jianmin Miao, Joachim Wuerfl, Dorothee Rueck and Hans L. Hartnagel, “Buried selectively etchable microstructures in GaAs using deep nitrogen implantation”, Radiation Effects and Defects in Solids, Vol. 126, 1993, pp. 365-368.

 

94.  Joachim Wuerfl, Jianmin Miao, Dorothee Rueck and Hans L. Hartnagel, “Deep implantation of nitrogen into GaAs for selective three dimensional microstructuring”, Journal of Applied Physics, Vol. 72, No. 7, October 1992, pp. 2700-2704.

 

 

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