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EMERL has the
state of the art equipments and a group of dedicated
researchers to facilitate
Electromagnetic effects related research.
On-going projects
Core Competency Building for High-Speed
Sub Nano Second Digital Design for Signal integrity and
Electromagnetic Emission Compliance
As technology continues to advance, processor clock frequency
increases with edge rates reduce to sub-nano second range. The
performance is no longer determined only by the device
technology but also influenced significantly by interconnects.
As timing budget reduces because of higher speed, it increases
the timing uncertainty of the digital signal. This causes a
design that works well in the laboratory to become unreliable
when integrated onto the printed circuit boards (PCBs). Hence,
the issue of SI can no longer be neglected and must be
characterized and modelled with good accuracy. Furthermore,
faster operating speed leads to wider frequency bandwidth, the
transmission line and parasitic effects of interconnects have to
be accounted for. The layout of board is equally crucial and any
minor flaw in high-speed digital board layout can easily cause
the system to fail the EMI regulatory limits.
In view of the importance of SI and EMI radiation in high-speed
digital circuit, the proposed project aims to achieve the
following objectives:
a)
Board Level
Signal Integrity
b)
Board Level Radiated
EMI Analysis
Critical Study of Red/Black Signal
Coupling and Isolation
Most design engineers rely heavily on design
guidelines given in the so called “well-established standards”
passed down from experienced engineers. These guidelines
are usually based upon sound engineering judgments; with little
rigorous analysis supporting them. It is well known that
different PCB layouts and subsystem packaging for the same
equipment yield vastly different compromising emanation from
escaping through direct electromagnetic radiation and signal
line coupling from RED to BLACK lines. Therefore, a fundamental
understanding of how the different layouts and packaging affect
the levels of compromising emanation would prevent applying
design rules rigidly and leading to over designing the
equipment.
Developing Semi-transparent EMI Shielding
on Flexible Substrate
In
this project, a light weight EMI shielding material is to be
developed which is also transparent to some extent. The semi
transparent shielding will be prepared by printing on a
transparent substrate to achieve good shielding using an
Advanced Printing Technology.
Correlation of Reverberation Chamber with Semi-anechoic Chamber
To
study the correction of results tested in reverberation chamber
and in the semi-anechoic chamber
Completed projects
EMC Design for High-Speed Digital Board
With the worldwide concern of electromagnetic pollution (or
commonly known as electromagnetic interference, EMI), the
research collaboration facilitates the exchange of design
expertise between European and ASEAN universities to reduce the
unwanted electromagnetic emission from consumer electronics
(PDA, mobile phone, MP3 player, etc)
Light-Weight Shielding Material
To
explore the feasibility of using porous metal as light weight
and rugged electromagnetic shielding material for building that
requires protection against external electromagnetic fields.
Power Line Communication Design with Low
Radiated Emission
To explore mechanism of emission from Power Line Communication
Systems for designing effective solutions to lower emission from
Power Line Communication network.
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