ElectroMagnetic Effects Research Lab


Home
| People | Research | Facilities | News & Announcements | Contact  Us    
 

 

 

 

EMC Design for High-Speed Digital Board
Light-Weight Shielding Material
Power Line Communication Design with Low Radiated Emission

EMERL has the state of the art equipments and a group of dedicated researchers to facilitate Electromagnetic effects related research.
 

On-going projects

Core Competency Building for High-Speed Sub Nano Second Digital Design for Signal integrity and Electromagnetic Emission Compliance
As technology continues to advance, processor clock frequency increases with edge rates reduce to sub-nano second range. The performance is no longer determined only by the device technology but also influenced significantly by interconnects. As timing budget reduces because of higher speed, it increases the timing uncertainty of the digital signal. This causes a design that works well in the laboratory to become unreliable when integrated onto the printed circuit boards (PCBs). Hence, the issue of SI can no longer be neglected and must be characterized and modelled with good accuracy. Furthermore, faster operating speed leads to wider frequency bandwidth, the transmission line and parasitic effects of interconnects have to be accounted for. The layout of board is equally crucial and any minor flaw in high-speed digital board layout can easily cause the system to fail the EMI regulatory limits.
In view of the importance of SI and EMI radiation in high-speed digital circuit, the proposed project aims to achieve the following objectives:
a) Board Level Signal Integrity
b
) Board Level Radiated EMI Analysis

Critical Study of Red/Black Signal Coupling and Isolation
Most design engineers rely heavily on design guidelines given in the so called “well-established standards” passed down from experienced engineers. These guidelines are usually based upon sound engineering judgments; with little rigorous analysis supporting them. It is well known that different PCB layouts and subsystem packaging for the same equipment yield vastly different compromising emanation from escaping through direct electromagnetic radiation and signal line coupling from RED to BLACK lines. Therefore, a fundamental understanding of how the different layouts and packaging affect the levels of compromising emanation would prevent applying design rules rigidly and leading to over designing the equipment.

Developing Semi-transparent EMI Shielding on Flexible Substrate
In this project, a light weight EMI shielding material is to be developed which is also transparent to some extent. The semi transparent shielding will be prepared by printing on a transparent substrate to achieve good shielding using an Advanced Printing Technology.

Correlation of Reverberation Chamber with Semi-anechoic Chamber
To study the correction of results tested in reverberation chamber and in the semi-anechoic chamber

Completed projects

EMC Design for High-Speed Digital Board
With the worldwide concern of electromagnetic pollution (or commonly known as electromagnetic interference, EMI), the research collaboration facilitates the exchange of design expertise between European and ASEAN universities to reduce the unwanted electromagnetic emission from consumer electronics (PDA, mobile phone, MP3 player, etc)

Light-Weight  Shielding Material
To explore the feasibility of using porous metal as light weight and rugged electromagnetic shielding material for building that requires protection against external electromagnetic fields.

Power Line Communication Design with Low Radiated Emission
To explore mechanism of emission from Power Line Communication Systems for designing effective solutions to lower emission from Power Line Communication network.

 

 

 







 

 

Home | People | Research | Facilities | News & Announcements | Contact  Us

Copyright © 2007 NTU, DSO & EMERL All rights reserved.