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Research Report

Research Report 2007

Research Report 2007
(full report)

Research Report 2006

Achievements

Achievements 2007

Achievements 2006

Research Report 2007

Introduction

The continuous growth in integrated circuit (IC) and electronic design activities in Singapore has resulted in very good student enrolments in our final year electronics option as well as the IC Design Specialist Manpower Programme (SMP) and NTU-TUM MSc Course in IC Design. Besides playing a leading role in IC design manpower training for the nation’s expanding electronics and IC design industries, the Division has also done extremely well in research.

On 12th January, the Division signed an agreement with Advanced RFIC (aRfic) Pte Ltd to set up the $9 million new research laboratory, Advanced RFIC@NTU. The collaboration aims to advance research and development in RFIC technology. The new research laboratory contains state-of-the-art equipment, including a world-class 300 mm probe system that makes modelling, measurement and characterization of nano-RF devices as well as integrated circuits and systems possible. 30 postgraduate scholarships have also been set aside to expand the research activities in RFIC design.

On 4th September, NTU has established the Institute for Sustainable Nanoelectronics (ISNE), a new initiative led by the division. The ISNE aims at designing and developing the next generation of embedded IC chips which consume significantly less energy with low production costs.   The ISNE has received a seed funding of $4 million to kick off its research activities. The ISNE strategy will be led by Professor Krishna Palem of Rice University, who is also the Canon Visiting Professor of NTU. To officially launch the ISNE, an inaugural workshop was planned on 29th October with many international renowned nano-electronics researchers shared their latest research with NTU researchers. NTU aims to build the ISNE into an international centre of excellence in five years. Our colleagues have participated actively in 6 projects to be funded by the ISNE.

On 7th September, another new research laboratory led by the Division, the $10 million Electromagnetic Effects Research Laboratory (EMERL) set up jointly with DSO National Laboratories, was officially opened by the Defence Minister, Mr Teo Chee Hean. The Semi-Anechoic Chamber and the Reverberation Chamber in the EMERL allow advanced Electromagnetic Compatibility (EMC) measurement for any electronic system up to 40 GHz. With the worldwide trends of imposing EMC regulations on practically all electronic devices, the setting up of EMERL is timely for the division to play a key role to spearhead advanced EMC research, to ensure that electronic devices and systems are well designed with low electromagnetic emission, as well as high electromagnetic immunity.  

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MOU signing for the setting up of Advanced RFIC@NTU.




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Defence Minister, Mr Teo Chee Hean (4th from the left) unveiling the commemorative plaque at the EMERL opening ceremony


With all these newly added research facilities, research initiatives and a strong research team, the Division is well positioned to build up the System-on-Chip (SoC) capability for the realization of many SoC systems, such as Software Defined Radio (SDR) systems, that can be easily configured to operate at many existing and future worldwide air-interface standards, and ultimately to become the universal mobile communication system.

 
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Highlights

In this research report, the Division would like to highlight some of the research works carried out by our colleagues. One of the main components in microwave receiver is the Voltage-Controlled Oscillator (VCO). The unity frequency ft, which is defined as the frequency where the transistor current gain becomes unity for 0.18μm is about 40 GHz for optimum biasing. In a circuit with large biasing swing like a VCO, the ft can be as low as 15 GHz. This proves to be a major problem for VCO design as the VCO needs to work at 24 GHz. In addition, other parameters like tuning range and phase noise could be greatly affected by the low unity frequency. The Division has developed a VCO with an oscillation frequency of 23 GHz using CMOS transistor with ft of 15.8 GHz. Based on the 0.18μm CMOS process, it has been  demonstrated that using novel push-pull buffer, a VCO can operate up to almost double the unity frequency.

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Microphotograph of the 23 GHz VCO








IC Reliability
is another important aspect of IC design, especially with the continuous reduction in line width and the increasing in the number of metallization layers.  Our colleagues have developed the physical modelling of the electromigration that allows accurate prediction the failure sites for interconnects with different line widths and structures under various stress conditions. With the model, different category of failure mechanisms could be predicted for failure analysis. 


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(a) FIB-SEM image of failed sample, (b) total AFD distribution at M1 test condition.




High-speed Digital Signal Processing (DSP) is a dedicated module that has to cope with the complexity and diverse processing requirements and specifications of different SoC systems. Traditional techniques for multiplierless filtering are to optimize the digital filter coefficients in signed power-of-two (SPT) coefficient space, and thus the coefficient multiplications are replaced by additions and shifts.  However, the design of digital filters with discrete coefficient values may not always be possible in some applications such as in adaptive filtering. The Division has developed a new technique where signals are converted into a sum of a limited number of SPT terms.  Since hardware circuitry for the real time conversion is available, the filter is also multiplierless even though the coefficient values are not SPT.  The new technique could handle very complex signal processing needs with low power consumption.

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Comparison of quantization error of the new technique (solid lines) and the measured results (histogram plots)





With high-speed electronic systems operate at sub-nano second edge rates, board-level integration becomes a very challenging task. The interconnects begin to behave as transmission lines. In addition, parasitic effects due to inter-layer vias, interconnect bends and gap in ground plane, start to show their impacts on circuit performance at these edge rates. Hence, Signal Integrity (SI) and EMC are becoming major issues for high-speed board design.  The SI and EMC issues, if not properly resolved, will lead to unstable and intermittent operation problems. The research group in EMERL has done extensive research work and have developed a systematic design methodology in SI/EMC compliant high-speed designs.
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Near-field electromagnetic scanning results indicating hot-spot areas that are causing SI/EMC problems



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